SFFS624 March   2024 MSPM0G3105 , MSPM0G3106 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3506 , MSPM0G3507 , MSPM0G3507-Q1

 

  1.   1
  2. 1Introduction
    1.     Trademarks
  3. 2 MSPM0G Hardware Component Functional Safety Capability
  4. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
    2. 3.2 TI Functional Safety Development Process
  5. 4 MSPM0G Component Overview
    1. 4.1 Targeted Applications
    2. 4.2 Hardware Component Functional Safety Concept
    3. 4.3 Functional Safety Constraints and Assumptions
  6. 5Description of Hardware Component Parts
    1. 5.1  ADC
    2. 5.2  Comparator
    3. 5.3  DAC
    4. 5.4  OPA
    5. 5.5  CPU
    6. 5.6  RAM
    7. 5.7  FLASH
    8. 5.8  GPIO
    9. 5.9  DMA
    10. 5.10 SPI
    11. 5.11 I2C
    12. 5.12 UART
    13. 5.13 Timers (TIMx)
    14. 5.14 Power Management Unit (PMU)
    15. 5.15 Clock Module (CKM)
    16. 5.16 CAN-FD
  7. 6 MSPM0G Management of Random Faults
    1. 6.1 Fault Reporting
    2. 6.2 Functional Safety Mechanism Categories
    3. 6.3 Description of Functional Safety Mechanisms
      1. 6.3.1  ADC1,COMP1,DAC1,DMA1,GPIO2,TIM2,I2C2,IOMUX1,OA1,SPI2,UART2,SYSCTL5,MCAN2: Periodic read of static configuration registers
      2. 6.3.2  ADC2: Software test of function
      3. 6.3.3  ADC3: ADC trigger overflow check
      4. 6.3.4  ADC4: Window comparator
      5. 6.3.5  OA2: Test of OA using internal DAC as a driver
      6. 6.3.6  COMP2: Software test of Comparator using internal DAC
      7. 6.3.7  WDT: Windowed watch dog timer
      8. 6.3.8  CPU1: CPU test using software test library
      9. 6.3.9  CPU2: Software test of CPU data busses
      10. 6.3.10 SYSMEM4: Parity protection on SRAM
      11. 6.3.11 FLASH1: Flash Single Error Correction, Double Error Detection mechanism
      12. 6.3.12 DAC2: DAC test using internal ADC as DAC output checker
      13. 6.3.13 DAC3: DAC FIFO underrun interrupt
      14. 6.3.14 DMA2: Software test of DMA function
      15. 6.3.15 GPIO1: GPIO test using pin IO loopback
      16. 6.3.16 TIM1: Test for PWM generation
      17. 6.3.17 I2C1: Software test of I2C function using internal loopback mechanism
      18. 6.3.18 SPI1 : Software test of SPI function
      19. 6.3.19 SPI3: SPI periodic safety message exchange
      20. 6.3.20 UART1: Software test of UART function
      21. 6.3.21 SYSCTL1: MCLK monitor
      22. 6.3.22 SYSCTL2: HFCLK startup monitor
      23. 6.3.23 SYSCTL3: LFCLK monitor
      24. 6.3.24 SYSCTL4: RTC monitor
      25. 6.3.25 SYSCTL6: SYSPLL startup monitor
      26. 6.3.26 SYSCTL8: Brownout Reset (BOR) Supervisor
      27. 6.3.27 SYSCTL9: FCC counter logic to calculate clock frequencies
      28. 6.3.28 SYSCTL10: External voltage monitor
      29. 6.3.29 SYSCTL11: Boot process monitor
      30. 6.3.30 SYSCTL12: TRIM bits parity protection
      31. 6.3.31 SYSCTL14: Brownout Voltage Monitor
      32. 6.3.32 SYSCTL15: External voltage monitor
      33. 6.3.33 MCAN1: Software test of function using I/O Loopback
      34. 6.3.34 MCAN4: SRAM ECC
      35. 6.3.35 MCAN5: Software test of ECC check logic
      36. 6.3.36 MCAN6: MCAN timeout function
      37. 6.3.37 MCAN7: MCAN timestamp function
  8. 7An In-Context Look at This Safety Element out of Context
    1. 7.1 System Functional Safety Concept Examples
  9.   A Summary of Recommended Functional Safety Mechanism Usage (Optional)
  10.   B Distributed Developments
    1.     B.1 How the Functional Safety Lifecycle Applies to TI Functional Safety Products
    2.     B.2 Activities Performed by Texas Instruments
    3.     B.3 Information Provided

1 Introduction

This document is a functional safety manual for the Texas Instruments MSPM0G component. The specific orderable part numbers supported by this functional safety manual are as follows:

  • MSPM0G3105
  • MSPM0G3106
  • MSPM0G3107
  • MSPM0G3505
  • MSPM0G3506
  • MSPM0G3507

This functional safety manual provides information needed by system developers to help in the creation of a functional safety system using a MSPM0G component. This document includes:

  • An overview of the component architecture
  • An overview of the development process used to decrease the probability of systematic failures
  • An overview of the functional safety architecture for management of random failures
  • The details of architecture partitions and implemented functional safety mechanisms

The following information is documented in the Functional Safety Analysis Report and is not repeated in this document:

  • Summary of failure rates (FIT) of the component
  • Summary of functional safety metrics of the hardware component for targeted standards
  • Quantitative functional safety analysis (also known as FMEDA, Failure Modes, Effects, and Diagnostics Analysis) with detail of the different parts of the component, allowing for customized application of functional safety mechanisms
  • Assumptions used in the calculation of functional safety metrics

The following information is documented in the Functional Safety Report, and is not repeated in this document:

  • Results of assessments of compliance to targeted standards

The user of this document should have a general familiarity with the MSPM0G component. For more information, refer to the MSPM0G310x-Q1 and MSPM0G350x-Q1 data sheets. This document is intended to be used in conjunction with the pertinent data sheets, technical reference manuals, and other component documentation.

For information that is beyond the scope of the listed deliverables, contact your TI sales representative or go to www.ti.com/functionalsafety.

ADVANCE INFORMATION for preproduction products; subject to change without notice.