SFFS624 March   2024 MSPM0G3105 , MSPM0G3106 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3506 , MSPM0G3507 , MSPM0G3507-Q1

 

  1.   1
  2. 1Introduction
    1.     Trademarks
  3. 2 MSPM0G Hardware Component Functional Safety Capability
  4. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
    2. 3.2 TI Functional Safety Development Process
  5. 4 MSPM0G Component Overview
    1. 4.1 Targeted Applications
    2. 4.2 Hardware Component Functional Safety Concept
    3. 4.3 Functional Safety Constraints and Assumptions
  6. 5Description of Hardware Component Parts
    1. 5.1  ADC
    2. 5.2  Comparator
    3. 5.3  DAC
    4. 5.4  OPA
    5. 5.5  CPU
    6. 5.6  RAM
    7. 5.7  FLASH
    8. 5.8  GPIO
    9. 5.9  DMA
    10. 5.10 SPI
    11. 5.11 I2C
    12. 5.12 UART
    13. 5.13 Timers (TIMx)
    14. 5.14 Power Management Unit (PMU)
    15. 5.15 Clock Module (CKM)
    16. 5.16 CAN-FD
  7. 6 MSPM0G Management of Random Faults
    1. 6.1 Fault Reporting
    2. 6.2 Functional Safety Mechanism Categories
    3. 6.3 Description of Functional Safety Mechanisms
      1. 6.3.1  ADC1,COMP1,DAC1,DMA1,GPIO2,TIM2,I2C2,IOMUX1,OA1,SPI2,UART2,SYSCTL5,MCAN2: Periodic read of static configuration registers
      2. 6.3.2  ADC2: Software test of function
      3. 6.3.3  ADC3: ADC trigger overflow check
      4. 6.3.4  ADC4: Window comparator
      5. 6.3.5  OA2: Test of OA using internal DAC as a driver
      6. 6.3.6  COMP2: Software test of Comparator using internal DAC
      7. 6.3.7  WDT: Windowed watch dog timer
      8. 6.3.8  CPU1: CPU test using software test library
      9. 6.3.9  CPU2: Software test of CPU data busses
      10. 6.3.10 SYSMEM4: Parity protection on SRAM
      11. 6.3.11 FLASH1: Flash Single Error Correction, Double Error Detection mechanism
      12. 6.3.12 DAC2: DAC test using internal ADC as DAC output checker
      13. 6.3.13 DAC3: DAC FIFO underrun interrupt
      14. 6.3.14 DMA2: Software test of DMA function
      15. 6.3.15 GPIO1: GPIO test using pin IO loopback
      16. 6.3.16 TIM1: Test for PWM generation
      17. 6.3.17 I2C1: Software test of I2C function using internal loopback mechanism
      18. 6.3.18 SPI1 : Software test of SPI function
      19. 6.3.19 SPI3: SPI periodic safety message exchange
      20. 6.3.20 UART1: Software test of UART function
      21. 6.3.21 SYSCTL1: MCLK monitor
      22. 6.3.22 SYSCTL2: HFCLK startup monitor
      23. 6.3.23 SYSCTL3: LFCLK monitor
      24. 6.3.24 SYSCTL4: RTC monitor
      25. 6.3.25 SYSCTL6: SYSPLL startup monitor
      26. 6.3.26 SYSCTL8: Brownout Reset (BOR) Supervisor
      27. 6.3.27 SYSCTL9: FCC counter logic to calculate clock frequencies
      28. 6.3.28 SYSCTL10: External voltage monitor
      29. 6.3.29 SYSCTL11: Boot process monitor
      30. 6.3.30 SYSCTL12: TRIM bits parity protection
      31. 6.3.31 SYSCTL14: Brownout Voltage Monitor
      32. 6.3.32 SYSCTL15: External voltage monitor
      33. 6.3.33 MCAN1: Software test of function using I/O Loopback
      34. 6.3.34 MCAN4: SRAM ECC
      35. 6.3.35 MCAN5: Software test of ECC check logic
      36. 6.3.36 MCAN6: MCAN timeout function
      37. 6.3.37 MCAN7: MCAN timestamp function
  8. 7An In-Context Look at This Safety Element out of Context
    1. 7.1 System Functional Safety Concept Examples
  9.   A Summary of Recommended Functional Safety Mechanism Usage (Optional)
  10.   B Distributed Developments
    1.     B.1 How the Functional Safety Lifecycle Applies to TI Functional Safety Products
    2.     B.2 Activities Performed by Texas Instruments
    3.     B.3 Information Provided

5.1 ADC

Both 12-bit analog-to-digital converter (ADC) modules in these devices, ADC0 and ADC1, support fast 12-bit conversions with single-ended inputs and simultaneous sampling operation.

ADC features include:

  • 12-bit output resolution at 4Msps with greater than 11 ENOB
  • HW averaging enables 14-bit effective resolution at 250ksps
  • Up to 17 total external input channels with individual result storage registers
  • Internal channels for temperature sensing, supply monitoring, and analog signal chain (interconnection with OPA, DAC)
  • Software selectable reference:
    • Configurable internal reference voltage of 1.4V and 2.5V (requires decoupling capacitor on VREF+/- pins)
    • MCU supply voltage (VDD)
    • External reference supplied to the ADC through the VREF+/- pins
  • Operates in RUN, SLEEP, and STOP modes

For more details, see the ADC chapter of the MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual.

The following tests can be applied as functional safety mechanisms for this module (to provide diagnostic coverage on a specific function):