ZHCSQM0B December   2022  – December 2024 TPSM82816

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Precise Enable (EN)
      2. 7.3.2 Output Discharge
      3. 7.3.3 COMP/FSET
      4. 7.3.4 MODE/SYNC
      5. 7.3.5 Spread Spectrum Clocking (SSC)
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 Power-Good Output (PG)
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation (PWM) Operation
      2. 7.4.2 Power Save Mode Operation (PSM)
      3. 7.4.3 100% Duty-Cycle Operation
      4. 7.4.4 Current Limit and Short-Circuit Protection
      5. 7.4.5 Soft Start / Tracking (SS/TR)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Feedforward Capacitor
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Voltage Tracking
      2. 8.3.2 Synchronizing to an External Clock
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Thermal Consideration
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方产品免责声明
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • VCA|13
  • SIE|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPSM8281x UNIT
SIE (14 PINS) VCA (13 PINS)
JEDEC 51-5 EVM JEDEC 51-7 EVM
RθJA Junction-to-ambient thermal resistance 45.3 32.2 72.1 26.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29 n/a (2) 37.2 n/a (2) °C/W
RθJB Junction-to-board thermal resistance 27.4 n/a (2) 21.2 n/a (2) °C/W
ΨJT Junction-to-top characterization parameter 5.7 7.2 (-0.4)(3) (-1.9)(3) °C/W
ΨJB Junction-to-board characterization parameter 16.2 12.7 20.8 10.1 °C/W
(1) For more information about thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Not applicable to an EVM.
(3) The junction temperature is lower than the inductor temperature leading to a temperature increase towards the top of the package