ZHCSQM0 December 2022 TPSM82816
PRODUCTION DATA
The TPSM82816 module temperature must be kept less than the maximum rating of 125°C. The following are three basic approaches for enhancing thermal performance:
To estimate the approximate module temperature of the TPSM82816, apply the typical efficiency stated in this data sheet to the desired application condition to compute the power dissipation of the module. Then, calculate the module temperature rise by multiplying the power dissipation by its thermal resistance. For more details on how to use the thermal parameters in real applications, see the application notes: Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs and Semiconductor and IC Package Thermal Metrics.
The thermal values in Thermal Information used the recommended land pattern, shown at the end of this data sheet, including the 30 vias as they are shown. The TPSM82816 was simulated on a PCB defined by JEDEC 51-7. The 15 vias on the GND pins were connected to copper on other PCB layers, while the remaining 15 vias were not connected to other layers.