ZHCSTR3B December   2010  – November 2023 TPS53315

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  D-CAP™ Integrated Circuit with Adaptive On-Time
      2. 6.3.2  Small Signal Model
      3. 6.3.3  Ramp Signal
      4. 6.3.4  Auto-Skip Eco-mode Light Load Operation
      5. 6.3.5  Adaptive Zero Crossing
      6. 6.3.6  Forced Continuous Conduction Mode
      7. 6.3.7  Power Good
      8. 6.3.8  Current Sense and Overcurrent Protection
      9. 6.3.9  Overvoltage and Undervoltage Protection
      10. 6.3.10 UVLO Protection
      11. 6.3.11 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Enable and Soft Start
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Circuit Diagram
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Step 1: Select Operation Mode and Soft-Start Time
          2. 7.2.1.2.2 Step 2: Select Switching Frequency
          3. 7.2.1.2.3 Step 3: Select the Inductance
          4. 7.2.1.2.4 Step 4: Select Output Capacitors
          5. 7.2.1.2.5 Step 5: Determine the Voltage-Divider Resistance (R1 and R2)
          6. 7.2.1.2.6 Step 6: Select the Overcurrent Resistance (RTRIP)
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Typical Application Circuit Diagram With Ceramic Output Capacitors
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Step 1: Select Operation Mode and Soft-Start Time
          2. 7.2.2.2.2 Step 2: Select Switching Frequency
          3. 7.2.2.2.3 Step 3: Select the Inductance
          4. 7.2.2.2.4 Step 4: Select Output Capacitance for Ceramic Capacitors
          5. 7.2.2.2.5 Step 5: Select the Overcurrent Setting Resistance (RTRIP)
        3. 7.2.2.3 External Component Selection When Using All Ceramic Output Capacitors
        4. 7.2.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
Input voltageVIN (main supply)–0.317V
VDD–0.328
VBST–0.324
VBST(with respect to LL)–0.37
EN, TRIP, VFB, RF, MODE–0.37
Output voltageLLDC–123V
Pulse < 20 ns, E = 5 μJ–7
PGOOD, VREG–0.37
PGND–0.30.3
Source/sink currentVBST50mA
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds300°C
Operating free-air temperature, TA–4085°C
Junction temperature, TJ–40150°C
Storage temperature, Tstg–55150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.