ZHCSTR3B December   2010  – November 2023 TPS53315

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  D-CAP™ Integrated Circuit with Adaptive On-Time
      2. 6.3.2  Small Signal Model
      3. 6.3.3  Ramp Signal
      4. 6.3.4  Auto-Skip Eco-mode Light Load Operation
      5. 6.3.5  Adaptive Zero Crossing
      6. 6.3.6  Forced Continuous Conduction Mode
      7. 6.3.7  Power Good
      8. 6.3.8  Current Sense and Overcurrent Protection
      9. 6.3.9  Overvoltage and Undervoltage Protection
      10. 6.3.10 UVLO Protection
      11. 6.3.11 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Enable and Soft Start
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Circuit Diagram
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Step 1: Select Operation Mode and Soft-Start Time
          2. 7.2.1.2.2 Step 2: Select Switching Frequency
          3. 7.2.1.2.3 Step 3: Select the Inductance
          4. 7.2.1.2.4 Step 4: Select Output Capacitors
          5. 7.2.1.2.5 Step 5: Determine the Voltage-Divider Resistance (R1 and R2)
          6. 7.2.1.2.6 Step 6: Select the Overcurrent Resistance (RTRIP)
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Typical Application Circuit Diagram With Ceramic Output Capacitors
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Step 1: Select Operation Mode and Soft-Start Time
          2. 7.2.2.2.2 Step 2: Select Switching Frequency
          3. 7.2.2.2.3 Step 3: Select the Inductance
          4. 7.2.2.2.4 Step 4: Select Output Capacitance for Ceramic Capacitors
          5. 7.2.2.2.5 Step 5: Select the Overcurrent Setting Resistance (RTRIP)
        3. 7.2.2.3 External Component Selection When Using All Ceramic Output Capacitors
        4. 7.2.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。