ZHCSA32C JULY   2012  – April 2019 TPS53015

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Drivers
      2. 7.3.2 5-Volt Regulator
      3. 7.3.3 Soft-Start and Pre-biased Soft-Start Time
      4. 7.3.4 Overcurrent Protection
      5. 7.3.5 Overvoltage and Undervoltage Protection
      6. 7.3.6 UVLO Protection
      7. 7.3.7 Thermal Shutdown
      8. 7.3.8 Power Good
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 Auto-skip Eco-Mode Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Determine the Inductance Value
        2. 8.2.2.2 Output Capacitor
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Bootstrap Capacitor
        5. 8.2.2.5 VREG5 Capacitor
        6. 8.2.2.6 Choose Output Voltage Resistors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 商标
    2. 11.2 静电放电警告
    3. 11.3 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS53015 UNIT
DGS (VSSOP)
10 PINS
RθJA Junction-to-ambient thermal resistance 109.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31.2 °C/W
RθJB Junction-to-board thermal resistance 54.7 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 54.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.