ZHCSQB8B July   2021  – October 2022 TPS38700-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device State Diagram
      2. 8.3.2 Built-In Self Test and Configuration Load
      3. 8.3.3 CLK32K
      4. 8.3.4 BACKUP State
      5. 8.3.5 FAILSAFE State
      6. 8.3.6 Transitioning Sequences
        1. 8.3.6.1 Sequence 1: Power Up
        2. 8.3.6.2 Sequence 2: Emergency Power Down
        3. 8.3.6.3 Sequence 3: Sleep Entry
        4. 8.3.6.4 Sequence 4: Sleep Exit
        5. 8.3.6.5 Sequence 5 & 6: Power Down from Active and Sleep States
        6. 8.3.6.6 Sequence 7: Sleep Exit due to NRST_IN
        7. 8.3.6.7 Sequence 8: RESET due to NRST_IN
        8. 8.3.6.8 Sequence 9: Failsafe Power Down
        9. 8.3.6.9 Output Sequencing
      7. 8.3.7 I2C
    4. 8.4 Register Map Table
      1. 8.4.1 Register Descriptions
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Automotive Multichannel Sequencer and Monitor
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Guidelines
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
      1.      Mechanical, Packaging, and Orderable Information

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Detailed Design Procedure

  • TPS38700-Q1 device comes preprogrammed with the power up, power down, sleep entry, and sleep exit sequences shown in Table 9-1 and Table 9-2.
  • NIRQ and NRST pins both require a pull up resistor in the range of 10 kΩ to 100 kΩ.
  • SDA and SCL lines require pull up resistors in the range of 10 kΩ.
  • The ACT pin is driven by an external safety microcontroller. When the ACT pin is driven high, the device enters into ACTIVE mode as described in Section 8.3.6.1. When the ACT pin is driven low, the device enters into SHDN mode as described in Section 8.3.6.5.
  • The safety microcontroller is used to clear fault interrupts reported through the NIRQ interrupt pin and the INT_SCR1 and INT_SCR2 registers. The interrupt flags can only be cleared by the host micrcontroller with a write-1-to-clear operation; interrupt flags are not automatically cleared if the fault condition is no longer present.
  • The SLEEP pin is driven by the SOC. When the SLEEP pin is driven low, the device enters into Sleep mode as shown in Section 8.3.6.3. When the SLEEP pin is driven high, the device exits Sleep mode as shown in Section 8.3.6.4.
  • The safety microcontroller should be connected to the NEM_PD input pin of the TPS38700-Q1 device in order to enable emergency power down functionality. When this pin is driven low, the TPS38700-Q1 device will enter into power down sequence. Power down due to NEM_PD is shown in Figure 8-12.