ZHCSP14 September   2021 TPS25854-Q1 , TPS25855-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Power Down or Undervoltage Lockout
      2. 10.3.2  Input Overvoltage Protection (OVP) - Continuously Monitored
      3. 10.3.3  Buck Converter
      4. 10.3.4  FREQ/SYNC
      5. 10.3.5  Bootstrap Voltage (BOOT)
      6. 10.3.6  Minimum ON-time, Minimum OFF-time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Current Limit and Short Circuit Protection
        1. 10.3.8.1 USB Switch Programmable Current Limit (ILIM)
        2. 10.3.8.2 Cycle-by-Cycle Buck Current Limit
        3. 10.3.8.3 OUT Current Limit
      9. 10.3.9  Cable Compensation
      10. 10.3.10 Thermal Management With Temperature Sensing (TS) and OTSD
      11. 10.3.11 Thermal Shutdown
      12. 10.3.12 FAULT Indication
      13. 10.3.13 USB Specification Overview
      14. 10.3.14 USB Type-C® Basics
        1. 10.3.14.1 Configuration Channel
        2. 10.3.14.2 Detecting a Connection
        3. 10.3.14.3 Plug Polarity Detection
      15. 10.3.15 USB Port Operating Modes
        1. 10.3.15.1 USB Type-C® Mode
        2. 10.3.15.2 Dedicated Charging Port (DCP) Mode
          1. 10.3.15.2.1 DCP BC1.2 and YD/T 1591-2009
          2. 10.3.15.2.2 DCP Divider-Charging Scheme
          3. 10.3.15.2.3 DCP 1.2-V Charging Scheme
        3. 10.3.15.3 DCP Auto Mode
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Active Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Output Voltage Setting
        2. 11.2.2.2 Switching Frequency
        3. 11.2.2.3 Inductor Selection
        4. 11.2.2.4 Output Capacitor Selection
        5. 11.2.2.5 Input Capacitor Selection
        6. 11.2.2.6 Bootstrap Capacitor Selection
        7. 11.2.2.7 Undervoltage Lockout Set-Point
        8. 11.2.2.8 Cable Compensation Set-Point
        9. 11.2.2.9 FAULT, POL, and THERM_WARN Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
    3. 13.3 Ground Plane and Thermal Considerations
  14. 14Device and Documentation Support
    1. 14.1 接收文档更新通知
    2. 14.2 支持资源
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 术语表
  15. 15Mechanical, Packaging, and Orderable Information

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8.6 Timing Requirements

Over the recommended operating junction temperature range of -40 °C to 150 °C (unless otherwise noted)
MIN NOM MAX UNIT
tDEGLA_FAULT Asserting deglitch time (Thermal SD Fault assertion is instantaneous, not subject to this timing) 2.94 4.1 5.42 ms
tDEGLD_FAULT De-asserting deglitch time 11.09 16.38 23.03 ms
BUS DISCHARGE
tDEGA_BUS_DCHG Discharge asserting deglitch 5.6 12.3 21.2 ms
tW_BUS_DCHG VBUS discharge time after sink termination removed from CC lines VBUS = 1 V, time ISNK_OUT > 1 mA after sink termination removed from CC lines 170 260 360 ms
POWER SWITCH TIMING
tIOS_HI_DEG Deglitch time for USB power switch current limit enable USB port enter overcurrent (per ILIM setting) 1.228 2.048 2.867 ms
tIOS_HI_RST MFI OCP reset timing 9.6 16 22.4 ms
tr_USB PA_BUS, PB_BUS voltage rise time CL = 1 µF, RL = 100 Ω (measured from 10% to 90% of final value) 1.67 ms
tf_USB PA_BUS, PB_BUS voltage fall time CL = 1 µF, RL = 100 Ω (measured from 90% to 10% of final value) 0.49 ms
ton_USB PA_BUS, PB_BUS voltage turnon-time CL = 1 µF, RL = 100 Ω 2.59 ms
toff_USB PA_BUS, PB_BUS voltage turnoff-time CL = 1 µF, RL = 100 Ω 2.07 ms
tIOS_USB PA_BUS, PB_BUS short-circuit response time CL = 1 µF, RL = 1 Ω 1 us
tr_OUT OUT voltage rise time CL = 1 µF, RL = 100 Ω (measured from 10% to 90% of final value) 0.12 0.2 0.28 ms
tf_OUT OUT voltage fall time CL = 1 µF, RL = 100 Ω (measured from 90% to 10% of final value) 0.16 0.22 0.28 ms
ton_OUT OUT voltage turnon-time CL = 1 µF, RL = 100 Ω 0.6 1.1 1.65 ms
toff_OUT OUT voltage turnoff-time CL = 1 µF, RL = 100 Ω 0.45 0.54 0.62 ms
tIOS_OUT OUT short-circuit response time CL = 1 µF, RL = 1 Ω 1.4 4 us
tIOS_VCONN  CC-VCONN short circuit response time CL = 1 µF, RL = 1 Ω 1 3.5 µs
tr_VCONN VCONN output voltage rise time CL = 1 µF, RL = 100 Ω (measured from 10% to 90% of final value); 5.1KΩ on CC1 and 1KΩ on CC2 0.2 0.28 0.36 ms
tf_VCONN VCONN output voltage fall time CL = 1 µF, RL = 100 Ω (measured from 90% to 10% of final value); 5.1KΩ on CC1 and 1KΩ on CC2 0.18 0.23 0.28 ms
ton_VCONN VCONN output voltage turnon time CL = 1 µF, RL = 100 Ω; 5.1KΩ on CC1 and 1KΩ on CC2 0.7 1.2 1.7 ms
toff_VCONN VCONN output voltage turnoff time CL = 1 µF, RL = 100 Ω; 5.1KΩ on CC1 and 1KΩ on CC2 0.37 0.44 0.51 ms
HICCUP MODE
THICP_ON OUT, PA_BUS, PB_BUS output hiccup mode ON time OC, VOUT, VPA_BUS, VPB_BUS drop 10% 2.94 4.1 5.42 ms
THICP_OFF OUT, PA_BUS, PB_BUS output hiccup mode OFF time OC, OUT, PA_BUS, PB_BUS connect to GND 367 524 715 ms