ZHCSLF3A June   2020  – December 2020 TLV740P

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Foldback Current Limit
      2. 7.3.2 Output Enable
      3. 7.3.3 Active Discharge
      4. 7.3.4 Undervoltage Lockout (UVLO) Operation
      5. 7.3.5 Dropout Voltage
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Transient Response
      6. 8.1.6 Reverse Current
      7. 8.1.7 Power Dissipation (PD)
        1. 8.1.7.1 Estimating Junction Temperature
        2. 8.1.7.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表

封装选项

机械数据 (封装 | 引脚)
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订购信息

6.5 Electrical Characteristics

at operating temperature range (TJ = +25°C), VIN = VOUT(NOM) + 2.1 V, IOUT = 1 mA, VEN = VIN, and CIN = COUT = 1 μF, (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
Output accuracy1 V ≤ VOUT ≤ 3.3 V–11%
Maximum output current(1)300mA
Output voltage temperature coefficientIOUT = 0.1 mA, –40°C ≤ TJ ≤ +85°C0.0017%/℃
Line regulationVOUT(NOM) + 0.5 V ≤ VIN ≤ 5.5 V 15mV
Load regulation1 mA ≤ IOUT ≤ 300 mA1030mV
VDODropout voltageVOUT = 0.95 x VOUT(nom)
 		1 V ≤ VOUT  < 1.8 V, IOUT = 300 mA12001300mV
VOUT = 0.95 x VOUT(nom)
 		1.8 V ≤ VOUT < 2.1 V, IOUT = 300 mA700800
VOUT = 0.95 x VOUT(nom)
 		2.1 V ≤ VOUT ≤ 3.3 V, IOUT = 300 mA460500
IGNDGround currentIOUT = 0 mA5080µA
ISHDNShutdown currentVEN ≤ 0.4 V, 3.1 V ≤ VIN ≤ 5.5 V, –40°C ≤ TJ ≤ +85°C0.11µA
PSRRPower-supply rejection ratioVIN = 5.4 V,
VOUT = 3.3 V,
IOUT = 150 mA		f = 100 Hz67dB
f = 10 kHz45
f = 1 MHz32
VnOutput noise voltageBW = 100 Hz to 100 kHz, VOUT = 1.0 V, IOUT = 1 mA65µVRMS
tSTRStartup time(2)COUT = 1 µF, IOUT = 300 mA100µs
VHIEN pin high voltage (enabled)–40°C ≤ TJ ≤ +85°C1.0VIN V
VLOEN pin low voltage (disabled)00.4V
IENEnable pin currentEN = 5.5 V, –40°C ≤ TJ ≤ +85°C10nA
RPULLDOWNPulldown resistanceVIN = 5.5 V, VEN = 0 V120Ω
ICLOutput current limit360mA
ISCShort circuit current limitVOUT = 0 V40mA
TSD(shutdown)Thermal shutdown temperatureShutdown, temperature increasing158°C
TSD(reset)Thermal shutdown reset temperatureReset, temperature decreasing140
(1) Maximum output current is affected by the PCB layout, metal trace width, number of layers, ambient temperatrue and other environmental factors.  Thermal limitations of the system must be carefully considered.
(2) Startup time = time from EN assertion to 0.95 × VOUT(NOM).