ZHCSUT0D October   2001  – February 2024 TFP410

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 T.M.D.S. Pixel Data and Control Signal Encoding
      2. 6.3.2 Universal Graphics Controller Interface Voltage Signal Levels
      3. 6.3.3 Universal Graphics Controller Interface Clock Inputs
    4. 6.4 Device Functional Modes
      1. 6.4.1 Universal Graphics Controller Interface Modes
      2. 6.4.2 Data De-skew Feature
      3. 6.4.3 Hot Plug/Unplug (Auto Connect/Disconnect Detection)
      4. 6.4.4 Device Configuration and I2C RESET Description
      5. 6.4.5 DE Generator
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
    6. 6.6 Register Maps
      1. 6.6.1  VEN_ID Register (Sub-Address = 01−00 ) [reset = 0x014C]
      2. 6.6.2  DEV_ID Register (Sub-Address = 03–02) [reset = 0x0410]
      3. 6.6.3  REV_ID Register (Sub-Address = 04) [reset = 0x00]
      4. 6.6.4  Reserved Register (Sub-Address = 07–05) [reset = 0x641400]
      5. 6.6.5  CTL_1_MODE (Sub-Address = 08) [reset = 0xBE]
      6. 6.6.6  CTL_2_MODE Register (Sub-Address = 09) [reset = 0x00]
      7. 6.6.7  CTL_3_MODE Register (Sub-Address = 0A) [reset = 0x80]
      8. 6.6.8  CFG Register (Sub-Address = 0B)
      9. 6.6.9  RESERVED Register (Sub-Address = 0E–0C) [reset = 0x97D0A9]
      10. 6.6.10 DE_DLY Register (Sub-Address = 32) [reset = 0x00]
      11. 6.6.11 DE_CTL Register (Sub-Address = 33) [reset = 0x00]
      12. 6.6.12 DE_TOP Register (Sub-Address = 34) [reset = 0x00]
      13. 6.6.13 DE_CNT Register (Sub-Address = 37–36) [reset = 0x0000]
      14. 6.6.14 DE_LIN Register (Sub-Address = 39–38) [reset = 0x0000]
      15. 6.6.15 H_RES Register (Sub-Address = 3B−3A)
      16. 6.6.16 V_RES Register (Sub-Address = 3D−3C)
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Data and Control Signals
        2. 7.2.2.2 Configuration Options
        3. 7.2.2.3 Power Supplies Decoupling
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 DVDD
      2. 7.3.2 TVDD
      3. 7.3.3 PVDD
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Layer Stack
        2. 7.4.1.2 Routing High-Speed Differential Signal Traces (RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+)
        3. 7.4.1.3 DVI Connector
      2. 7.4.2 Layout Example
      3. 7.4.3 TI PowerPAD 64-Pin HTQFP Package
  9. Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PAP|64
散热焊盘机械数据 (封装 | 引脚)
订购信息

CTL_3_MODE Register (Sub-Address = 0A) [reset = 0x80]

Figure 6-15 CTL_3_MODE Register
7 6 5 4 3 2 1 0
DK[3:1] DKEN RSVD CTL[2:1] RSVD
Table 6-10 CTL_3_MODE Register Field Descriptions
Bit Field Type Description
7:5 DK[3:1] RW This read/write register contains the de-skew setting, each increment adjusts the skew by t(STEP).
000: Step 1 (minimum setup/maximum hold)
001: Step 2
010: Step 3
011: Step 4
100: Step 5 (default)
101: Step 6
110: Step 7
111: Step 8 (maximum setup/minimum hold)
4 DKEN RW This read/write register controls the data de-skew enable.
0: Data de-skew is disabled, the values in DK[3:1] are not used
1: Data de-skew is enabled, the de-skew setting is controlled through DK[3:1]
3 RSVD RW
2:1 CTL[2:1] RW This read/write register contains the values of the two CTL[2:1] bits that are output on the DVI port during the blanking interval.
0 RSVD RW