SLLS573E December   2003  – March 2024 SN65MLVD200A , SN65MLVD202A , SN65MLVD204A , SN65MLVD205A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics – Driver
    7. 6.7  Electrical Characteristics – Receiver
    8. 6.8  Electrical Characteristics – BUS Input and Output
    9. 6.9  Switching Characteristics – Driver
    10. 6.10 Switching Characteristics – Receiver
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-On Reset
      2. 8.3.2 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Function Tables
      2. 8.4.2 Equivalent Input and Output Schematic Diagrams
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Supply Voltage
        2. 9.2.2.2  Supply Bypass Capacitance
        3. 9.2.2.3  Driver Input Voltage
        4. 9.2.2.4  Driver Output Voltage
        5. 9.2.2.5  Termination Resistors
        6. 9.2.2.6  Receiver Input Signal
        7. 9.2.2.7  Receiver Input Threshold (Failsafe)
        8. 9.2.2.8  Receiver Output Signal
        9. 9.2.2.9  Interconnecting Media
        10. 9.2.2.10 PCB Transmission Lines
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip Versus Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Electrical Characteristics

over recommended operating conditions unless otherwise noted
PARAMETERTEST CONDITIONSMINTYP(1)MAXUNIT
ICCSupply currentDriver onlyRE and DE at VCC, RL = 50 Ω, All others open1322mA
Both disabledRE at VCC, DE at 0 V, RL = No Load, All others open14
Both enabledRE at 0 V, DE at VCC, RL = 50 Ω, All others open1624
Receiver onlyRE at 0 V, DE at 0 V, All others open413
PDDevice power dissipationRL = 50 Ω, Input to D is a 50-MHz 50% duty cycle square wave,
DE = high, RE = low, TA = 85°C		94mW
(1) All typical values are at 25°C and with a 3.3-V supply voltage.