ZHCSTL4C
October 2023 – February 2025
MSPM0C1103
,
MSPM0C1104
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
功能方框图
5
Device Comparison
6
Pin Configuration and Functions
6.1
Pin Diagrams
6.2
Pin Attributes
6.3
Signal Descriptions
6.4
Connections for Unused Pins
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Supply Current Characteristics
7.5.1
RUN/SLEEP Modes
7.5.2
STOP/STANDBY Modes
7.5.3
SHUTDOWN Mode
7.6
Power Supply Sequencing
7.6.1
POR and BOR
7.6.2
Power Supply Ramp
7.7
Flash Memory Characteristics
7.8
Timing Characteristics
7.9
Clock Specifications
7.9.1
System Oscillator (SYSOSC)
7.9.2
Low Frequency Oscillator (LFOSC)
7.10
Digital IO
7.10.1
Electrical Characteristics
7.10.2
Switching Characteristics
7.11
ADC
7.11.1
Electrical Characteristics
7.11.2
Switching Characteristics
7.11.3
Linearity Parameters
7.11.4
Typical Connection Diagram
7.12
Temperature Sensor
7.13
VREF
7.13.1
Voltage Characteristics
7.13.2
Electrical Characteristics
7.14
I2C
7.14.1
I2C Characteristics
7.14.2
I2C Filter
7.14.3
I2C Timing Diagram
7.15
SPI
7.15.1
SPI
7.15.2
SPI Timing Diagrams
7.16
UART
7.17
TIMx
7.18
Windowed Watchdog Characteristics
7.19
Emulation and Debug
7.19.1
SWD Timing
8
Detailed Description
8.1
CPU
8.2
Operating Modes
8.2.1
Functionality by Operating Mode (MSPM0C110x)
8.3
Power Management Unit (PMU)
8.4
Clock Module (CKM)
8.5
DMA
8.6
Events
8.7
Memory
8.7.1
Memory Organization
8.7.2
Peripheral File Map
8.7.3
Peripheral Interrupt Vector
8.8
Flash Memory
8.9
SRAM
8.10
GPIO
8.11
IOMUX
8.12
ADC
8.13
Temperature Sensor
8.14
VREF
8.15
CRC
8.16
UART
8.17
SPI
8.18
I2C
8.19
WWDT
8.20
Timers (TIMx)
8.21
Device Analog Connections
8.22
Input/Output Diagrams
8.23
Serial Wire Debug Interface
8.24
Device Factory Constants
8.25
Identification
9
Applications, Implementation, and Layout
9.1
Typical Application
9.1.1
Schematic
10
Device and Documentation Support
10.1
Device Nomenclature
10.2
Tools and Software
10.3
支持资源
10.4
Trademarks
10.5
静电放电警告
10.6
术语表
11
Revision History
12
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
DYY|16
DDF|8
RUK|20
PW|20
DGS|20
DSG|8
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcstl4c_oa
zhcstl4c_pm
7.6
Power Supply Sequencing