ZHCSLU2B December   2021  – October 2023 LM63460-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Wettable Flanks
    2. 6.2 Pinout Design for Clearance and FMEA
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Systems Characteristics
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN1, VIN2)
      2. 8.3.2  Output Voltage Setpoint (FB)
      3. 8.3.3  Precision Enable and Input Voltage UVLO (EN/SYNC)
      4. 8.3.4  Frequency Synchronization (EN/SYNC)
      5. 8.3.5  Clock Locking
      6. 8.3.6  Adjustable Switching Frequency (RT)
      7. 8.3.7  Power-Good Monitor (PGOOD)
      8. 8.3.8  Bias Supply Regulator (VCC, BIAS)
      9. 8.3.9  Bootstrap Voltage and UVLO (CBOOT)
      10. 8.3.10 Spread Spectrum
      11. 8.3.11 Soft Start and Recovery From Dropout
      12. 8.3.12 Overcurrent and Short-Circuit Protection
      13. 8.3.13 Thermal Shutdown
      14. 8.3.14 Input Supply Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 CCM Mode
        2. 8.4.3.2 AUTO Mode – Light-Load Operation
          1. 8.4.3.2.1 Diode Emulation
          2. 8.4.3.2.2 Frequency Foldback
        3. 8.4.3.3 FPWM Mode – Light-Load Operation
        4. 8.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 8.4.3.5 Dropout
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – Automotive Synchronous Buck Regulator at 2.1 MHz
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2  Setting the Output Voltage
          3. 9.2.1.2.3  Choosing the Switching Frequency
          4. 9.2.1.2.4  Inductor Selection
          5. 9.2.1.2.5  Output Capacitor Selection
          6. 9.2.1.2.6  Input Capacitor Selection
          7. 9.2.1.2.7  Bootstrap Capacitor
          8. 9.2.1.2.8  VCC Capacitor
          9. 9.2.1.2.9  BIAS Power Connection
          10. 9.2.1.2.10 Feedforward Network
          11. 9.2.1.2.11 Input Voltage UVLO
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2 – Automotive Synchronous Buck Regulator at 400 kHz
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Thermal Design and Layout
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方产品免责声明
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Mechanical, Packaging, and Orderable Information

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6.2 Pinout Design for Clearance and FMEA

The LM63460-Q1 has a carefully designed pinout arrangement that provides additional clearance spacing between high-voltage pins (VIN, SW, and CBOOT) and nearby low-voltage pins (such as PGND). Moreover, the LM63460-Q1 pinout is designed for critical automotive applications requiring functional safety system design with stricter reliability and higher durability. In terms of pin FMEA (failure mode effects analysis), the typical failure scenarios considered include short circuit to ground, short circuit to input supply (VIN), short circuit to a neighboring pin, and if a pin is left open circuit. These faults are considered as applied externally to the IC and therefore are board-level failures rather than IC-level reliability failures. Example sources of such faults are stray conductive filaments causing pin-to-pin shorts or a board manufacturing defect causing an open-circuit track.