ZHCSI69B
june 2018 – september 2020
DS90C189-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Typical Application Diagrams
5
Revision History
6
Pin Configuration and Functions
DS90C189 Pin Descriptions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Recommended Input Characteristics
7.7
Switching Characteristics
7.8
AC Timing Diagrams
7.9
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagrams
8.3
Feature Description
8.3.1
AEC-Q100 Qualified
8.3.2
ESD Protection
8.3.3
Operating Modes
8.3.4
LVDS Configurations
8.4
Device Functional Modes
8.4.1
Device Configuration
8.4.2
Single Pixel Input / Single Pixel Output
8.4.3
Single Pixel Input / Dual Pixel Output
8.4.4
Pixel Clock Edge Select (RFB)
8.4.5
Power Management
8.4.6
Sleep Mode (PDB)
8.4.7
LVDS Outputs
8.4.8
LVCMOS Inputs
8.5
Programming
8.5.1
LVDS Interface / TFT Color Data Recommended Mapping
8.5.1.1
Color Mapping Information
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
LVDS Interconnect Guidelines
9.2.3
Application Curves
10
Power Supply Recommendations
10.1
Power Up Sequence
10.2
Power Supply Filtering
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
静电放电警告
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RTD|64
MPQF141C
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsi69b_oa
zhcsi69b_pm
12.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。