ZHCSKS2E april   2020  – june 2023 DRA821U , DRA821U-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
    1. 3.1 功能方框图
  5. Revision History
  6. Device Comparison
    1. 5.1 Related Products
  7. Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1. 6.3.1  ADC
        1. 6.3.1.1 MCU Domain
      2. 6.3.2  DDRSS
        1. 6.3.2.1 MAIN Domain
        2. 6.3.2.2 DDRSS Mapping
      3. 6.3.3  GPIO
        1. 6.3.3.1 MAIN Domain
        2. 6.3.3.2 WKUP Domain
      4. 6.3.4  I2C
        1. 6.3.4.1 MAIN Domain
        2. 6.3.4.2 MCU Domain
        3. 6.3.4.3 WKUP Domain
      5. 6.3.5  I3C
        1. 6.3.5.1 MAIN Domain
        2. 6.3.5.2 MCU Domain
      6. 6.3.6  MCAN
        1. 6.3.6.1 MAIN Domain
        2. 6.3.6.2 MCU Domain
      7. 6.3.7  MCSPI
        1. 6.3.7.1 MAIN Domain
        2. 6.3.7.2 MCU Domain
      8. 6.3.8  UART
        1. 6.3.8.1 MAIN Domain
        2. 6.3.8.2 MCU Domain
        3. 6.3.8.3 WKUP Domain
      9. 6.3.9  MDIO
        1. 6.3.9.1 MCU Domain
        2. 6.3.9.2 MAIN Domain
      10. 6.3.10 CPSW2G
        1. 6.3.10.1 MCU Domain
      11. 6.3.11 CPSW5G
        1. 6.3.11.1 MAIN Domain
      12. 6.3.12 ECAP
        1. 6.3.12.1 MAIN Domain
      13. 6.3.13 EQEP
        1. 6.3.13.1 MAIN Domain
      14. 6.3.14 EPWM
        1. 6.3.14.1 MAIN Domain
      15. 6.3.15 USB
        1. 6.3.15.1 MAIN Domain
      16. 6.3.16 SERDES
        1. 6.3.16.1 MAIN Domain
      17. 6.3.17 OSPI
        1. 6.3.17.1 MCU Domain
      18. 6.3.18 Hyperbus
        1. 6.3.18.1 MCU Domain
      19. 6.3.19 GPMC
        1. 6.3.19.1 MAIN Domain
      20. 6.3.20 MMC
        1. 6.3.20.1 MAIN Domain
      21. 6.3.21 CPTS
        1. 6.3.21.1 MAIN Domain
        2. 6.3.21.2 MCU Domain
      22. 6.3.22 MCASP
        1. 6.3.22.1 MAIN Domain
      23. 6.3.23 DMTIMER
        1. 6.3.23.1 MAIN Domain
        2. 6.3.23.2 MCU Domain
      24. 6.3.24 Emulation and Debug
        1. 6.3.24.1 MAIN Domain
      25. 6.3.25 System and Miscellaneous
        1. 6.3.25.1 Boot Mode Configuration
          1. 6.3.25.1.1 MAIN Domain
          2. 6.3.25.1.2 MCU Domain
        2. 6.3.25.2 Clock
          1. 6.3.25.2.1 MAIN Domain
          2. 6.3.25.2.2 WKUP Domain
        3. 6.3.25.3 System
          1. 6.3.25.3.1 MAIN Domain
          2. 6.3.25.3.2 WKUP Domain
          3. 6.3.25.3.3 VMON
        4. 6.3.25.4 EFUSE
      26. 6.3.26 Power Supply
    4. 6.4 Pin Multiplexing
    5. 6.5 Connections for Unused Pins
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Power-On-Hours (POH)
    5. 7.5 Operating Performance Points
    6. 7.6 Electrical Characteristics
      1. 7.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 7.6.3  HFOSC Electrical Characteristics
      4. 7.6.4  eMMCPHY Electrical Characteristics
      5. 7.6.5  SDIO Electrical Characteristics
      6. 7.6.6  ADC12BT Electrical Characteristics
      7. 7.6.7  LVCMOS Electrical Characteristics
      8. 7.6.8  USB2PHY Electrical Characteristics
      9. 7.6.9  SERDES Electrical Characteristics
      10. 7.6.10 DDR Electrical Characteristics
    7. 7.7 VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.7.2 Hardware Requirements
      3. 7.7.3 Programming Sequence
      4. 7.7.4 Impact to Your Hardware Warranty
    8. 7.8 Thermal Resistance Characteristics
      1. 7.8.1 Thermal Resistance Characteristics
    9. 7.9 Timing and Switching Characteristics
      1. 7.9.1 Timing Parameters and Information
      2. 7.9.2 Power Supply Sequencing
        1. 7.9.2.1 Power Supply Slew Rate Requirement
        2. 7.9.2.2 Combined MCU and Main Domains Power- Up Sequencing
        3. 7.9.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 7.9.2.4 Independent MCU and Main Domains Power- Up Sequencing
        5. 7.9.2.5 Independent MCU and Main Domains Power- Down Sequencing
        6. 7.9.2.6 Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        7. 7.9.2.7 Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        8. 7.9.2.8 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 7.9.3 System Timing
        1. 7.9.3.1 Reset Timing
        2. 7.9.3.2 Safety Signal Timing
        3. 7.9.3.3 Clock Timing
      4. 7.9.4 Clock Specifications
        1. 7.9.4.1 Input Clocks / Oscillators
          1. 7.9.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 7.9.4.1.1.1 Load Capacitance
            2. 7.9.4.1.1.2 Shunt Capacitance
          2. 7.9.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 7.9.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 7.9.4.1.3.1 Load Capacitance
            2. 7.9.4.1.3.2 Shunt Capacitance
          4. 7.9.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 7.9.4.1.5 Auxiliary OSC1 Not Used
          6. 7.9.4.1.6 WKUP_LF_CLKIN Internal Oscillator Clock Source
          7. 7.9.4.1.7 WKUP_LF_CLKIN Not Used
        2. 7.9.4.2 Output Clocks
        3. 7.9.4.3 PLLs
        4. 7.9.4.4 Recommended Clock and Control Signal Transition Behavior
        5. 7.9.4.5 Interface Clock Specifications
          1. 7.9.4.5.1 Interface Clock Terminology
          2. 7.9.4.5.2 Interface Clock Frequency
      5. 7.9.5 Peripherals
        1. 7.9.5.1  ATL
          1. 7.9.5.1.1 ATL_PCLK Timing Requirements
          2. 7.9.5.1.2 ATL_AWS[x] Timing Requirements
          3. 7.9.5.1.3 ATL_BWS[x] Timing Requirements
          4. 7.9.5.1.4 ATCLK[x] Switching Characteristics
        2. 7.9.5.2  CPSW2G
          1. 7.9.5.2.1 CPSW2G RMII Timings
            1. 7.9.5.2.1.1 Timing Requirements for RMII[x]_REFCLK – RMII Mode
            2. 7.9.5.2.1.2 Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER – RMII Mode
            3. 7.9.5.2.1.3 Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN – RMII Mode
          2. 7.9.5.2.2 CPSW2G RGMII Timings
            1. 7.9.5.2.2.1 Timing Requirements for RGMII[x]_RCLK – RGMII Mode
            2. 7.9.5.2.2.2 Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.9.5.2.2.3 Switching Characteristics for RGMII[x]_TCLK – RGMII Mode
            4. 7.9.5.2.2.4 Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TCTL – RGMII Mode
        3. 7.9.5.3  CPSW5G
          1. 7.9.5.3.1 CPSW5G MDIO Interface Timings
          2. 7.9.5.3.2 CPSW5G RMII Timings
            1. 7.9.5.3.2.1 Timing Requirements for RMII[x]_REFCLK – RMII Mode
            2. 7.9.5.3.2.2 Timing Requirements for RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER – RMII Mode
            3. 7.9.5.3.2.3 Switching Characteristics for RMII[x]_TXD[1:0], and RMII[x]_TXEN – RMII Mode
          3. 7.9.5.3.3 CPSW5G RGMII Timings
            1. 7.9.5.3.3.1 Timing Requirements for RGMII[x]_RCLK – RGMII Mode
            2. 7.9.5.3.3.2 Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.9.5.3.3.3 Switching Characteristics for RGMII[x]_TCLK – RGMII Mode
            4. 7.9.5.3.3.4 Switching Characteristics for RGMII[x]_TD[3:0], and RGMII[x]_TCTL – RGMII Mode
        4. 7.9.5.4  DDRSS
        5. 7.9.5.5  ECAP
          1. 7.9.5.5.1 Timing Requirements for ECAP
          2. 7.9.5.5.2 Switching Characteristics for ECAP
        6. 7.9.5.6  EPWM
          1. 7.9.5.6.1 Timing Requirements for EPWM
          2. 7.9.5.6.2 Switching Characteristics for EPWM
        7. 7.9.5.7  EQEP
          1. 7.9.5.7.1 Timing Requirements for EQEP
          2. 7.9.5.7.2 Switching Characteristics for EQEP
        8. 7.9.5.8  GPIO
        9. 7.9.5.9  GPMC
          1. 7.9.5.9.1 GPMC and NOR Flash — Synchronous Mode
            1. 7.9.5.9.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 7.9.5.9.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 7.9.5.9.2 GPMC and NOR Flash — Asynchronous Mode
            1. 7.9.5.9.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 7.9.5.9.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 7.9.5.9.3 GPMC and NAND Flash — Asynchronous Mode
            1. 7.9.5.9.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 7.9.5.9.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
        10. 7.9.5.10 HyperBus
          1. 7.9.5.10.1 Timing Requirements for HyperBus Initialization
          2. 7.9.5.10.2 HyperBus 166 MHz Switching Characteristics
          3. 7.9.5.10.3 HyperBus 100 MHz Switching Characteristics
        11. 7.9.5.11 I2C
        12. 7.9.5.12 I3C
        13. 7.9.5.13 MCAN
        14. 7.9.5.14 MCASP
          1. 7.9.5.14.1 Timing Requirements for MCASP
        15. 7.9.5.15 MCSPI
          1. 7.9.5.15.1 MCSPI — Controller Mode
          2. 7.9.5.15.2 MCSPI — Peripheral Mode
        16. 7.9.5.16 eMMC/SD/SDIO
          1. 7.9.5.16.1 MMCSD0 - eMMC Interface
            1. 7.9.5.16.1.1 Legacy SDR Mode
            2. 7.9.5.16.1.2 High Speed SDR Mode
            3. 7.9.5.16.1.3 High Speed DDR Mode
            4. 7.9.5.16.1.4 HS200 Mode
            5. 7.9.5.16.1.5 HS400 Mode
          2. 7.9.5.16.2 MMCSDi — MMCSD1 — SD/SDIO Interface
            1. 7.9.5.16.2.1 Default speed Mode
            2. 7.9.5.16.2.2 High Speed Mode
            3. 7.9.5.16.2.3 UHS–I SDR12 Mode
            4. 7.9.5.16.2.4 UHS–I SDR25 Mode
            5. 7.9.5.16.2.5 UHS–I SDR50 Mode
            6. 7.9.5.16.2.6 UHS–I DDR50 Mode
            7. 7.9.5.16.2.7 UHS–I SDR104 Mode
        17. 7.9.5.17 NAVSS
          1. 7.9.5.17.1 Timing Requirements for CPTS Input
          2. 7.9.5.17.2 Switching Characteristics for CPTS Output
        18. 7.9.5.18 OSPI
          1. 7.9.5.18.1 OSPI With Data Training
            1. 7.9.5.18.1.1 OSPI Switching Characteristics – Data Training
          2. 7.9.5.18.2 OSPI Without Data Training
            1. 7.9.5.18.2.1 OSPI Switching Characteristics – DDR Mode
            2. 7.9.5.18.2.2 OSPI Switching Characteristics – SDR Mode
            3. 7.9.5.18.2.3 OSPI Timing Requirements – DDR Mode
            4. 7.9.5.18.2.4 OSPI Timing Requirements – SDR Mode
        19. 7.9.5.19 PCIE
        20. 7.9.5.20 Timers
          1. 7.9.5.20.1 Timing Requirements for Timers
          2. 7.9.5.20.2 Switching Characteristics for Timers
        21. 7.9.5.21 UART
          1. 7.9.5.21.1 UART Timing Requirements
          2. 7.9.5.21.2 UART Switching Characteristics
        22. 7.9.5.22 USB
      6. 7.9.6 Emulation and Debug
        1. 7.9.6.1 Debug Trace
        2. 7.9.6.2 IEEE 1149.1 Standard–Test–Access Port (JTAG)
          1. 7.9.6.2.1 JTAG Electrical Data and Timing
            1. 7.9.6.2.1.1 Timing Requirements for IEEE 1149.1 JTAG
            2. 7.9.6.2.1.2 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A72
      2. 8.2.2 Arm Cortex-R5F
    3. 8.3 Other Subsystems
      1. 8.3.1 MSMC
      2. 8.3.2 NAVSS
        1. 8.3.2.1 NAVSS0
        2. 8.3.2.2 MCU_NAVSS
      3. 8.3.3 PDMA Controller
      4. 8.3.4 Peripherals
        1. 8.3.4.1  ADC
        2. 8.3.4.2  ATL
        3. 8.3.4.3  CPSW2G
        4. 8.3.4.4  CPSW5G
        5. 8.3.4.5  DCC
        6. 8.3.4.6  DDRSS
        7. 8.3.4.7  ECAP
        8. 8.3.4.8  EPWM
        9. 8.3.4.9  ELM
        10. 8.3.4.10 ESM
        11. 8.3.4.11 EQEP
        12. 8.3.4.12 GPIO
        13. 8.3.4.13 GPMC
        14. 8.3.4.14 Hyperbus
        15. 8.3.4.15 I2C
        16. 8.3.4.16 I3C
        17. 8.3.4.17 MCAN
        18. 8.3.4.18 MCASP
        19. 8.3.4.19 MCRC Controller
        20. 8.3.4.20 MCSPI
        21. 8.3.4.21 MMC/SD
        22. 8.3.4.22 OSPI
        23. 8.3.4.23 PCIE
        24. 8.3.4.24 SerDes
        25. 8.3.4.25 WWDT
        26. 8.3.4.26 Timers
        27. 8.3.4.27 UART
        28. 8.3.4.28 USB
  10. Applications, Implementation, and Layout
    1. 9.1 Power Supply Mapping
    2. 9.2 Device Connection and Layout Fundamentals
      1. 9.2.1 Power Supply Decoupling and Bulk Capacitors
        1. 9.2.1.1 Power Distribution Network Implementation Guidance
      2. 9.2.2 External Oscillator
      3. 9.2.3 JTAG and EMU
      4. 9.2.4 Reset
      5. 9.2.5 Unused Pins
      6. 9.2.6 Hardware Design Guide for JacintoTM 7 Devices
    3. 9.3 Peripheral- and Interface-Specific Design Information
      1. 9.3.1 LPDDR4 Board Design and Layout Guidelines
      2. 9.3.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 9.3.2.1 No Loopback and Internal Pad Loopback
        2. 9.3.2.2 External Board Loopback
        3. 9.3.2.3 DQS (only available in Octal Flash devices)
      3. 9.3.3 USB VBUS Design Guidelines
      4. 9.3.4 System Power Supply Monitor Design Guidelines
      5. 9.3.5 High Speed Differential Signal Routing Guidance
      6. 9.3.6 Thermal Solution Guidance
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALM|433
散热焊盘机械数据 (封装 | 引脚)
订购信息

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
PARAMETER MIN MAX UNIT
VDD_CORE MAIN domain core supply -0.3 1.05 V
VDD_MCU MCUSS core supply -0.3 1.05 V
VDD_CPU CPU core supply -0.3 1.05 V
VDD_MCU_WAKE1 Core supply for MCU WAKE function -0.3 1.05 V
VDD_WAKE0 Core supply for MAIN domain WAKE function which includes all "CANUART" IO. -0.3 1.05 V
VDDA_0P8_DLL_MMC0 MMC0 DLL analog supply -0.3 1.05 V
VDDAR_CORE MAIN domain RAM supply -0.3 1.05 V
VDDAR_MCU MCUSS RAM supply -0.3 1.05 V
VDDAR_CPU CPU RAM supply -0.3 1.05 V
VDDA_0P8_SERDES0 SERDES0 analog supply low -0.3 1.05 V
VDDA_0P8_SERDES0_C SERDES0 clock supply -0.3 1.05 V
VDDA_0P8_USB USB0 0.8 V analog supply -0.3 1.05 V
VDDA_0P8_PLL_DDR DDR PLL analog supply -0.3 1.05 V
VDDA_1P8_USB USB0 1.8 V analog supply -0.3 2.2 V
VDDA_1P8_SERDES0 SERDES0 analog supply high -0.3 2.2 V
VDDA_3P3_USB USB0 3.3 V analog supply -0.3 3.8 V
VDDA_MCU_PLLGRP0 Analog supply for MCU PLL Group 0 -0.3 2.2 V
VDDA_PLLGRP0 Analog supply for MAIN PLL Group 0 -0.3 2.2 V
VDDA_PLLGRP4 Analog supply for MAIN PLL Group 4 -0.3 2.2 V
VDDA_PLLGRP6 Analog supply for MAIN PLL Group 6 -0.3 2.2 V
VDDA_PLLGRP8 Analog supply for MAIN PLL Group 8 -0.3 2.2 V
VDDA_WKUP Oscillator supply for WKUP domain -0.3 2.2 V
VDDA_ADC_MCU ADC analog supply -0.3 2.2 V
VDDA_MCU_TEMP Analog supply for temperature sensor 0 in MCU domain -0.3 2.2 V
VDDA_POR_WKUP WKUP domain analog supply -0.3 2.2 V
VDDA_TEMP0 Analog supply for temperature sensor 0 -0.3 2.2 V
VDDA_TEMP1 Analog supply for temperature sensor 1 -0.3 2.2 V
VDDS_DDR(10) DDR inteface power supply -0.3 1.2 V
VDDS_DDR_BIAS(10) Bias supply for LPDDR4 -0.3 1.2 V
VDDS_DDR_C(10) IO power for DDR Memory Clock Bit (MCB) macro -0.3 1.2 V
VDDS_MMC0 MMC0 IO supply -0.3 2.2 V
VDDA_OSC1 HFOSC1 supply -0.3 2.2 V
VDDSHV0_MCU IO supply MCUSS general IO group, and MCU and MAIN domain warm reset pins -0.3 3.8 V
VDDSHV0 IO supply for MAIN domain general -0.3 3.8 V
VDDSHV1_MCU IO supply for MCUSS IO group 1 -0.3 3.8 V
VDDSHV2_MCU IO supply for MCUSS IO group 2 -0.3 3.8 V
VDDSHV2 IO supply for MAIN domain IO group 2 -0.3 3.8 V
VDDSHV5 IO supply for MAIN domain IO group 5 -0.3 3.8 V
VPP_CORE Supply voltage range for CORE EFUSE domain -0.3 1.89 V
VPP_MCU Supply voltage range for MCU EFUSE domain -0.3 1.89 V
USB0_VBUS(9) Voltage range for USB VBUS comparator input -0.3 3.6 V
Steady State Max. Voltage at all fail-safe IO pins I2C0_SCL, I2C0_SDA, WKUP_I2C0_SCL, WKUP_I2C0_SDA, MCU_I2C0_SCL, MCU_I2C0_SDA, EXTINTn –0.3 3.8 V
MCU_PORz, PORz –0.3 3.8 V
VMON2_IR_VCPU -0.3 1.05 V
VMON3_IR_VEXT1P8, VMON4_IR_VEXT1P8, VMON1_ER_VSYS(8) –0.3 2.2 V
VMON5_IR_VEXT3P3 –0.3 3.8 V
Steady State Max. Voltage at all other IO pins(3) All other IO pins –0.3 IO supply voltage + 0.3 V
Transient Overshoot and Undershoot specification at IO pin 20% of IO supply voltage for up to 20% of signal period
(see Figure 7-1, IO Transient Voltage Ranges)
0.2 × VDD(6) V
Latch-up Performance, Class II (125°C)(4) I-Test –100 100 mA
Over-Voltage (OV) Test NA 1.5 × VDD(7) V
TSTG(5) Storage temperature -55 +150 °C
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Section 7.3, Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
All voltage values are with respect to their associated VSS or VSSA_x, unless otherwise noted.
This parameter applies to all IO pins which are not fail-safe and the requirement applies to all values of IO supply voltage. For example, if the voltage applied to a specific IO supply is 0 volts the valid input voltage range for any IO powered by that supply will be –0.3 to +0.3 volts. Special attention should be applied anytime peripheral devices are not powered from the same power sources used to power the respective IO supply. It is important the attached peripheral never sources a voltage outside the valid input voltage range, including power supply ramp-up and ramp-down sequences.
For current pulse injection:
Pins stressed per JEDEC JESD78E (Class II) and passed with specified I/O pin injection current and clamp voltage of 1.5 times maximum recommended I/O voltage and negative 0.5 times maximum recommended I/O voltage.
For overvoltage performance:
Supplies stressed per JEDEC JESD78E (Class II) and passed specified voltage injection.
For tape and reel the storage temperature range is [–10°C; +50°C] with a maximum relative humidity of 70%. TI recommends returning to ambient room temperature before usage.
VDD is the voltage on the corresponding power-supply pin(s) for the IO.
An external resistor divider is required to create the VMON input value that triggers with VTH = 0.45 when the VSYS level reaches the minimum allowed threshold. A series resistor R2 (VMON_ER_VSYS = VSYS × R1 / (R1 + R2)) of at least 10kΩ is recommended to limit current.
The VMON1_ER_VSYS pin provides a way to monitor the system power supply. For more information, see Section 9.3.4 System Power Supply Monitor Design Guidelines.
An external resistor divider is required to limit the voltage applied to this device pin. For more information, see Section 9.3.3, USB VBUS Design Guidelines.
A single 1.1V source must drive all three VDDS_DDR, VDDS_DDR_BIAS, VDDS_DDR_C supplies.

Fail-safe IO terminals are designed such they do not have dependencies on the respective IO power supply voltage. This allows external voltage sources to be connected to these IO terminals when the respective IO power supplies are turned off. The I2C0_SCL, I2C0_SDA, WKUP_I2C0_SCL, WKUP_I2C0_SDA, MCU_I2C0_SCL, MCU_I2C0_SDA, EXTINTn, MCU_PORz, PORz, VMON1_ER_VSYS, VMON2_IR_VCPU, VMON3_IR_VEXT1P8, VMON4_IR_VEXT1P8, VMON5_ER_VEXT3P3 are the only fail-safe IO terminals. All other IO terminals are not fail-safe and the voltage applied to them should be limited to the value defined by the Steady State Max. Voltage at all IO pins parameter in Section 7.1.

GUID-FE24F011-C90E-435B-A9FA-ED97D1CBA8E6-low.gif
Tovershoot + Tundershoot < 20% of Tperiod
Figure 7-1 IO Transient Voltage Ranges