ZHCSHH9D January 2017 – August 2021 DLPC3437
PRODUCTION DATA
Marking Definitions:
Line 1: | DLP® Device Name: DLPC343x wherex is a "7" for this device. SC: Solder ball composition e1: Indicates lead-free solder balls consisting of SnAgCu G8: Indicates lead-free solder balls consisting of tin-silver-copper (SnAgCu) with silver content less than or equal to 1.5% and that the mold compound meets TI's definition of green. |
Line 2: | TI Part Number DLP® Device Name: DLPC343x = x is a "7" for this device. R corresponds to the TI device revision letter for example A, B or C XXX corresponds to the device package designator. |
Line 3: | XXXXXXXXXX-TT Manufacturer Part Number |
Line 4: | LLLLLL.ZZZ Foundry lot code for semiconductor wafers LLLLLL: Fab lot number ZZZ: Lot split number |
Line 5: | AA YYWW ES : Package assembly information AA corresponds to the manufacturing site YYWW: Date code (YY = Year :: WW = Week) |