ZHCSJ19E november   2018  – august 2023 DAC60501 , DAC70501 , DAC80501

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: SPI Mode
    7. 7.7  Timing Requirements: I2C Standard Mode
    8. 7.8  Timing Requirements: I2C Fast Mode
    9. 7.9  Timing Requirements: I2C Fast-Mode Plus
    10. 7.10 Timing Diagrams
    11. 7.11 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Structure
        3. 8.3.1.3 Output Amplifier
      2. 8.3.2 Internal Reference
        1. 8.3.2.1 Solder Heat Reflow
      3. 8.3.3 Power-On-Reset (POR)
      4. 8.3.4 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 SPI Mode
          1. 8.5.1.1.1 SYNC Interrupt
        2. 8.5.1.2 I2C Mode
          1. 8.5.1.2.1 F/S Mode Protocol
          2. 8.5.1.2.2 I2C Update Sequence
            1. 8.5.1.2.2.1 Address Byte
            2. 8.5.1.2.2.2 Command Byte
            3. 8.5.1.2.2.3 Data Byte (MSDB and LSDB)
          3. 8.5.1.2.3 I2C Read Sequence
    6. 8.6 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Charge Injection
        2. 9.2.2.2 Voltage Droop
        3. 9.2.2.3 Output Offset Error
        4. 9.2.2.4 Switch Selection
        5. 9.2.2.5 Amplifier Selection
        6. 9.2.2.6 Hold Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

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4 Revision History

Changes from Revision D (February 2020) to Revision E (August 2023)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Added two rows for input current in Absolute Maximum Ratings Go
  • Changed output voltage drift vs time test conditions under Voltage Reference Output from TA = 35ºC, 1900 hr to TA = 25ºC, 1600 hr in the Electrical Characteristics Go
  • Changed output voltage drift vs time value under Voltage Reference Output from 20 µV to 50 ppm in the Electrical Characteristics Go
  • Changed Figure 7-48, Internal Reference Voltage vs Temperature Go
  • Changed Figure 7-49, Internal Reference Voltage vs Supply Voltage Go
  • Added text to end of paragraph to clarify phase margin in Output Amplifier sectionGo
  • Changed text in Internal Reference section for clarityGo
  • Changed all instances of legacy terminology to controller and target where I2C is mentionedGo
  • Changed section 8.6.2, DEVID Register, to clarify and correct reset valuesGo

Changes from Revision C (November 2019) to Revision D (February 2020)

  • Changed Figure 29 to remove broken text from x axis (typo)Go
  • Changed Figures 33, 34 and 35; updated for clarityGo

Changes from Revision B (August 2019) to Revision C (November 2019)

  • 将 DGS (VSSOP) 封装从预发布更改为量产数据（正在供货）Go
  • Added TUE parameter for DGS package to electrical characteristics tableGo
  • Added gain error parameter for DGS package to electrical characteristics tableGo
  • Added full-scale error parameter for DGS package to electrical characteristics tableGo

Changes from Revision A (August 2019) to Revision B (August 2019)

  • 将 DAC70501 和 DAC60501 器件从预发布更改为量产数据（正在供货）Go