ZHCSJ19E november   2018  – august 2023 DAC60501 , DAC70501 , DAC80501

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: SPI Mode
    7. 7.7  Timing Requirements: I2C Standard Mode
    8. 7.8  Timing Requirements: I2C Fast Mode
    9. 7.9  Timing Requirements: I2C Fast-Mode Plus
    10. 7.10 Timing Diagrams
    11. 7.11 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Structure
        3. 8.3.1.3 Output Amplifier
      2. 8.3.2 Internal Reference
        1. 8.3.2.1 Solder Heat Reflow
      3. 8.3.3 Power-On-Reset (POR)
      4. 8.3.4 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 SPI Mode
          1. 8.5.1.1.1 SYNC Interrupt
        2. 8.5.1.2 I2C Mode
          1. 8.5.1.2.1 F/S Mode Protocol
          2. 8.5.1.2.2 I2C Update Sequence
            1. 8.5.1.2.2.1 Address Byte
            2. 8.5.1.2.2.2 Command Byte
            3. 8.5.1.2.2.3 Data Byte (MSDB and LSDB)
          3. 8.5.1.2.3 I2C Read Sequence
    6. 8.6 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Charge Injection
        2. 9.2.2.2 Voltage Droop
        3. 9.2.2.3 Output Offset Error
        4. 9.2.2.4 Switch Selection
        5. 9.2.2.5 Amplifier Selection
        6. 9.2.2.6 Hold Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.3.1.2 DAC Register Structure

Data written to the DAC data registers are initially stored in the DAC buffer registers. The update mode of the DAC output is determined by the status of the DAC_SYNC_EN bit (address 2h).

In asynchronous mode (default, DAC_SYNC_EN = 0), a write to the DAC buffer register results in an immediate update of the DAC active register. In SPI mode, the DAC output (VOUT pin) updates on the rising edge of SYNC. In I2C mode, the DAC output (VOUT pin) updates on the falling edge of SCL on the last acknowledge bit.

In synchronous mode (DAC_SYNC_EN = 1), writing to the DAC buffer register does not automatically update the DAC active register. Instead, the update occurs only after a software LDAC trigger event. A software LDAC trigger generates through the LDAC bit in the TRIGGER register (address 5h). When the host reads from a DAC buffer register, the value held in the DAC buffer register is returned (not the value held in the DAC active register).