ZHCSGV7F July   2017  – January 2024 CDCI6214

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  EEPROM Characteristics
    6. 6.6  Reference Input, Single-Ended and Differential Mode Characteristics (REFP, REFN, FB_P, FB_N)
    7. 6.7  Reference Input, Crystal Mode Characteristics (XIN, XOUT)
    8. 6.8  General-Purpose Input and Output Characteristics (GPIO[4:1], SYNC/RESETN)
    9. 6.9  Triple Level Input Characteristics (EEPROMSEL, REFSEL)
    10. 6.10 Reference Mux Characteristics
    11. 6.11 Phase-Locked Loop Characteristics
    12. 6.12 Closed-Loop Output Jitter Characteristics
    13. 6.13 Output Mux Characteristics
    14. 6.14 LVCMOS Output Characteristics
    15. 6.15 HCSL Output Characteristics
    16. 6.16 LVDS DC-Coupled Output Characteristics
    17. 6.17 Programmable Differential AC-Coupled Output Characteristics
    18. 6.18 Output Skew and Delay Characteristics
    19. 6.19 Output Synchronization Characteristics
    20. 6.20 Timing Characteristics
    21. 6.21 I2C-Compatible Serial Interface Characteristics (SDA/GPIO2, SCL/GPIO3)
    22. 6.22 Timing Requirements, I2C-Compatible Serial Interface (SDA/GPIO2, SCL/GPIO3)
    23. 6.23 Power Supply Characteristics
    24. 6.24 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Parameters
      1. 7.1.1 Reference Inputs
      2. 7.1.2 Outputs
      3. 7.1.3 Serial Interface
      4. 7.1.4 Power Supply
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Reference Block
        1. 8.3.1.1 Input Stages
          1. 8.3.1.1.1 Crystal Oscillator
          2. 8.3.1.1.2 LVCMOS
          3. 8.3.1.1.3 Differential AC-Coupled
        2. 8.3.1.2 Reference Mux
        3. 8.3.1.3 Reference Divider
          1. 8.3.1.3.1 Doubler
        4. 8.3.1.4 Bypass-Mux
        5. 8.3.1.5 Zero Delay, Internal and External Path
      2. 8.3.2 Phase-Locked Loop
      3. 8.3.3 Clock Distribution
        1. 8.3.3.1 Output Channel
        2. 8.3.3.2 Divider Glitch-Less Update
      4. 8.3.4 Control Pins
        1. 8.3.4.1 Global and Individual Output Enable: OE and OE_Y[4:1]
      5. 8.3.5 Operation Modes
      6. 8.3.6 Divider Synchronization - SYNC
      7. 8.3.7 EEPROM - Cyclic Redundancy Check
      8. 8.3.8 Power Supplies
        1. 8.3.8.1 Power Management
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Mode
      2. 8.4.2 Serial Interface Mode
        1. 8.4.2.1 Fall-Back Mode
    5. 8.5 Programming
      1. 8.5.1 Recommended Programming Procedure
      2. 8.5.2 EEPROM Access
      3. 8.5.3 Device Defaults
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
    4. 9.4 Initialization Setup
    5. 9.5 Power Supply Recommendations
      1. 9.5.1 Power-Up Sequence
      2. 9.5.2 De-Coupling
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Examples
  11. 10Register Maps
    1. 10.1 CDCI6214 Registers
    2. 10.2 EEPROM Map
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
      2. 11.1.2 Device Nomenclature
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGE|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 Revision History

Changes from Revision E (October 2019) to Revision F (January 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 将提到 I2C 的旧术语实例通篇更改为控制器和目标Go
  • Changed Power supply ramp footnote in the Timing Characteristics table Go
  • Added additional details on VDD instability and instruction to set recal bit to a '1' to recalibrate the PLLGo
  • Updated references of chx_lvds_cmtrim_inc = 2 to chx_lvds_cmtrim_inc = 0Go

Changes from Revision D (June 2019) to Revision E (October 2019)

  • 删除了数据表中的分数输出分频器 (FOD) 和展频时钟 (SSC) 信息Go
  • Added footnote to Timing Characteristics table Go
  • Removed FOD from Functional Block Diagram Go
  • Changed REFSEL selection from L to H.Go
  • Removed Output Channel Divider Types and Delay table Go
  • Removed the FOD control bits in the Power Management graphicGo
  • Added Page-mode EEPROM read instructionsGo
  • Changed Pre-Configured EEPROM Page 0 graphicGo
  • Changed Pre-Configured EEPROM Page 1 graphicGo
  • Added additional details on pullup resistor and load capacitor added to power-up sequenceGo
  • Removed fractional output divider information from the registers Go
  • Removed FOD information from the CDCI6214 Registers tableGo

Changes from Revision C (November 2018) to Revision D (June 2019)

  • Added VDDREF and tablenote to the output supply voltage parameter in the Recommended Operating Conditions Go
  • Added statement on chX_1p8vdet setting Go
  • Changed CDCI6214 - Pre-Configured EEPROM Page 0 graphicGo

Changes from Revision B (April 2018) to Revision C (November 2018)

Changes from Revision A (October 2017) to Revision B (April 2018)

Changes from Revision * (July 2017) to Revision A (October 2017)

  • 将器件状态从“预告信息”更改为“量产数据”Go
  • Changed REFSEL pin description to reflext REFMUX control. Go