ZHCSIP0H
November 2009 – October 2024
CDC3RL02
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Low Additive Noise
7.3.2
Regulated 1.8V Externally Available I/O Supply
7.3.3
Ultra-Small 8-bump YFP 0.4mm Pitch WCSP Package
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.1.1
Input Clock Squarer
8.1.2
Output Stage
8.1.3
LDO
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
接收文档更新通知
9.3
支持资源
9.4
Trademarks
9.5
静电放电警告
9.6
术语表
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
YFP|8
MXBG057R
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsip0h_oa
zhcsip0h_pm
7.3
Feature Description