ZHCSIP0G
November 2009 – November 2022
CDC3RL02
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Low Additive Noise
8.3.2
Regulated 1.8-V Externally Available I/O Supply
8.3.3
Ultra-Small 8-bump YFP 0.4-mm Pitch WCSP Package
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.1.1
Input Clock Squarer
9.1.2
Output Stage
9.1.3
LDO
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
10
Device and Documentation Support
10.1
接收文档更新通知
10.2
支持资源
10.3
Trademarks
10.4
Electrostatic Discharge Caution
10.5
术语表
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
YFP|8
MXBG057R
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsip0g_oa
zhcsip0g_pm
10.5
术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。