ZHCSQS1B february   2022  – august 2023 CC2651R3SIPA

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. 功能方框图
  6. Revision History
  7. Device Comparison
  8. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions – SIPA Package
    3. 7.3 Connections for Unused Pins and Modules
  9. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Antenna Characteristics
    11. 8.11 Bluetooth Low Energy - Receive (RX)
    12. 8.12 Bluetooth Low Energy - Transmit (TX)
    13. 8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    14. 8.14 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Reset Timing
      2. 8.15.2 Wakeup Timing
      3. 8.15.3 Clock Specifications
        1. 8.15.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.15.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.15.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.15.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.15.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.15.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       37
      5. 8.15.5 UART
        1. 8.15.5.1 UART Characteristics
    16. 8.16 Peripheral Characteristics
      1. 8.16.1 ADC
        1. 8.16.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.16.2 DAC
        1. 8.16.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.16.3 Temperature and Battery Monitor
        1. 8.16.3.1 Temperature Sensor
        2. 8.16.3.2 Battery Monitor
      4. 8.16.4 Comparators
        1. 8.16.4.1 Continuous Time Comparator
      5. 8.16.5 Current Source
        1. 8.16.5.1 Programmable Current Source
      6. 8.16.6 GPIO
        1. 8.16.6.1 GPIO DC Characteristics
    17. 8.17 Typical Characteristics
      1. 8.17.1 MCU Current
      2. 8.17.2 RX Current
      3. 8.17.3 TX Current
      4. 8.17.4 RX Performance
      5. 8.17.5 TX Performance
      6. 8.17.6 ADC Performance
  10. Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Zigbee)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
    14. 9.14 Device Certification and Qualification
      1. 9.14.1 FCC Certification and Statement
      2. 9.14.2 IC/ISED Certification and Statement
      3. 9.14.3 ETSI/CE Certification
      4. 9.14.4 UK Certification
      5. 9.14.5 MIC Certification
      6. 9.14.6 Korea Certification
      7. 9.14.7 NCC Certification and Statement
    15. 9.15 Module Markings
    16. 9.16 End Product Labeling
    17. 9.17 Manual Information to the End User
  11. 10Application, Implementation, and Layout
    1. 10.1 Typical Application Circuit
    2. 10.2 Alternate Application Circuit
    3. 10.3 Device Connections
      1. 10.3.1 Reset
      2. 10.3.2 Unused Pins
    4. 10.4 PCB Layout Guidelines
      1. 10.4.1 General Layout Recommendations
      2. 10.4.2 Typical RF Layout Recommendations with Integrated Antenna
      3. 10.4.3 RF Layout Recommendations with External Antenna
        1. 10.4.3.1 External Antenna Placement and Routing
        2. 10.4.3.2 Transmission Line Considerations
      4. 10.4.4 Alternate PCB Layout Guidelines
    5. 10.5 Reference Designs
    6. 10.6 Junction Temperature Calculation
  12. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
      1. 12.2.1 SimpleLink™ Microcontroller Platform
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Bluetooth Low Energy - Receive (RX)

When measured on the CC2651RSIPA-EM reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed conducted.
 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
125 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –103 dBm
Receiver saturation Differential mode. BER = 10–3 >5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–300 / 300) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–320 / 240) ppm
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (255-byte packets) > (–125 / 125) ppm
Co-channel rejection(1) Wanted signal at –79 dBm, modulated interferer in channel, BER = 10–3 –1.5 dB
Selectivity, ±1 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±1 MHz, BER = 10–3 8 / 4.5(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±2 MHz, BER = 10–3  44 / 39(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±3 MHz, BER = 10–3 46 / 44(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –79 dBm, modulated interferer at ±4 MHz, BER = 10–3 44 / 46(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –79 dBm, modulated interferer at ≥ ±6 MHz, BER = 10–3 48 / 44(2) dB
Selectivity, ±7 MHz Wanted signal at –79 dBm, modulated interferer at ≥ ±7 MHz, BER = 10–3 51 / 45(2) dB
Selectivity, Image frequency(1) Wanted signal at –79 dBm, modulated interferer at image frequency, BER = 10–3 39 dB
Selectivity, Image frequency ±1 MHz(1) Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –79 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4.5 / 44 (2) dB
500 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –99 dBm
Receiver saturation Differential mode. BER = 10–3 > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–300 / 300) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–450 / 450) ppm
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (255-byte packets) > (–175 / 175) ppm
Co-channel rejection(1) Wanted signal at –72 dBm, modulated interferer in channel, BER = 10–3 –3.5 dB
Selectivity, ±1 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±1 MHz, BER = 10–3 8 / 4(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±2 MHz, BER = 10–3 44 / 37(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±3 MHz, BER = 10–3 46 / 42(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –72 dBm, modulated interferer at ±4 MHz, BER = 10–3 45 / 43(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –72 dBm, modulated interferer at ≥ ±6 MHz, BER = 10–3 46 / 45(2) dB
Selectivity, ±7 MHz Wanted signal at –72 dBm, modulated interferer at ≥ ±7 MHz, BER = 10–3 49 / 45(2) dB
Selectivity, Image frequency(1) Wanted signal at –72 dBm, modulated interferer at image frequency, BER = 10–3 37 dB
Selectivity, Image frequency ±1 MHz(1) Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –72 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4 / 46(2) dB
1 Mbps (LE 1M)
Receiver sensitivity Differential mode. BER = 10–3 –96 dBm
Receiver saturation Differential mode. BER = 10–3  > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–350 / 350) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–750 / 750) ppm
Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 –6 dB
Selectivity, ±1 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 7 / 4(2) dB
Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz,BER = 10–3 40 / 33(2) dB
Selectivity, ±3 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10–3 36 / 41(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 40 / 45(2) dB
Selectivity, ±5 MHz or more(1) Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz, BER = 10–3 40 dB
Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 33 dB
Selectivity, image frequency
±1 MHz(1)
Note that Image frequency + 1 MHz is the Co- channel –1 MHz. Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 4 / 41(2) dB
Out-of-band blocking(3) 30 MHz to 2000 MHz –10 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –18 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –12 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –2 dBm
Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level  –42 dBm
Spurious emissions,
30 to 1000 MHz
Measurement in a 50-Ω single-ended load. < –59 dBm
Spurious emissions,
1 to 12.75 GHz
Measurement in a 50-Ω single-ended load. < –47 dBm
RSSI dynamic range 70 dB
RSSI accuracy ±4 dB
2 Mbps (LE 2M)
Receiver sensitivity Differential mode. Measured at SMA connector, BER = 10–3  –91 dBm
Receiver saturation Differential mode. Measured at SMA connector, BER = 10–3 > 5 dBm
Frequency error tolerance Difference between the incoming carrier frequency and the internally generated carrier frequency > (–500 / 500) kHz
Data rate error tolerance Difference between incoming data rate and the internally generated data rate (37-byte packets) > (–700 / 750) ppm
Co-channel rejection(1) Wanted signal at –67 dBm, modulated interferer in channel,BER = 10–3 –7 dB
Selectivity, ±2 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, Image frequency is at –2 MHz, BER = 10–3 8 / 4(2) dB
Selectivity, ±4 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 36 / 36(2) dB
Selectivity, ±6 MHz(1) Wanted signal at –67 dBm, modulated interferer at ±6 MHz, BER = 10–3 37 / 36(2) dB
Selectivity, image frequency(1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 4 dB
Selectivity, image frequency
±2 MHz(1)
Note that Image frequency + 2 MHz is the Co-channel. Wanted signal at –67 dBm, modulated interferer at ±2 MHz from image frequency, BER = 10–3 –7 / 36(2) dB
Out-of-band blocking(3) 30 MHz to 2000 MHz –16 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –21 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –15 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –12 dBm
Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2408 and 2414 MHz respectively, at the given power level –38 dBm
Numbers given as I/C dB
X / Y, where X is +N MHz and Y is –N MHz
Excluding one exception at Fwanted / 2, per Bluetooth Specification