ZHCSQS1B february   2022  – august 2023 CC2651R3SIPA

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Signal Descriptions – SIPA Package
    3. 7.3 Connections for Unused Pins and Modules
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Antenna Characteristics
    11. 8.11 Bluetooth Low Energy - Receive (RX)
    12. 8.12 Bluetooth Low Energy - Transmit (TX)
    13. 8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    14. 8.14 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    15. 8.15 Timing and Switching Characteristics
      1. 8.15.1 Reset Timing
      2. 8.15.2 Wakeup Timing
      3. 8.15.3 Clock Specifications
        1. 8.15.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.15.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.15.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.15.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.15.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.15.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       37
      5. 8.15.5 UART
        1. 8.15.5.1 UART Characteristics
    16. 8.16 Peripheral Characteristics
      1. 8.16.1 ADC
        1. 8.16.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.16.2 DAC
        1. 8.16.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.16.3 Temperature and Battery Monitor
        1. 8.16.3.1 Temperature Sensor
        2. 8.16.3.2 Battery Monitor
      4. 8.16.4 Comparators
        1. 8.16.4.1 Continuous Time Comparator
      5. 8.16.5 Current Source
        1. 8.16.5.1 Programmable Current Source
      6. 8.16.6 GPIO
        1. 8.16.6.1 GPIO DC Characteristics
    17. 8.17 Typical Characteristics
      1. 8.17.1 MCU Current
      2. 8.17.2 RX Current
      3. 8.17.3 TX Current
      4. 8.17.4 RX Performance
      5. 8.17.5 TX Performance
      6. 8.17.6 ADC Performance
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Zigbee)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
    14. 9.14 Device Certification and Qualification
      1. 9.14.1 FCC Certification and Statement
      2. 9.14.2 IC/ISED Certification and Statement
      3. 9.14.3 ETSI/CE Certification
      4. 9.14.4 UK Certification
      5. 9.14.5 MIC Certification
      6. 9.14.6 Korea Certification
      7. 9.14.7 NCC Certification and Statement
    15. 9.15 Module Markings
    16. 9.16 End Product Labeling
    17. 9.17 Manual Information to the End User
  11. 10Application, Implementation, and Layout
    1. 10.1 Typical Application Circuit
    2. 10.2 Alternate Application Circuit
    3. 10.3 Device Connections
      1. 10.3.1 Reset
      2. 10.3.2 Unused Pins
    4. 10.4 PCB Layout Guidelines
      1. 10.4.1 General Layout Recommendations
      2. 10.4.2 Typical RF Layout Recommendations with Integrated Antenna
      3. 10.4.3 RF Layout Recommendations with External Antenna
        1. 10.4.3.1 External Antenna Placement and Routing
        2. 10.4.3.2 Transmission Line Considerations
      4. 10.4.4 Alternate PCB Layout Guidelines
    5. 10.5 Reference Designs
    6. 10.6 Junction Temperature Calculation
  12. 11Environmental Requirements and SMT Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 PCB Assembly Guide
      1. 11.4.1 PCB Land Pattern & Thermal Vias
      2. 11.4.2 SMT Assembly Recommendations
      3. 11.4.3 PCB Surface Finish Requirements
      4. 11.4.4 Solder Stencil
      5. 11.4.5 Package Placement
      6. 11.4.6 Solder Joint Inspection
      7. 11.4.7 Rework and Replacement
      8. 11.4.8 Solder Joint Voiding
    5. 11.5 Baking Conditions
    6. 11.6 Soldering and Reflow Condition
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
      1. 12.2.1 SimpleLink™ Microcontroller Platform
    3. 12.3 Documentation Support
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性

无线微控制器

  • 功能强大的 48MHz Arm® Cortex®-M4 处理器
  • 352KB 闪存程序存储器
  • 32KB 超低泄漏 SRAM
  • 8KB 缓存 SRAM（也可作为通用 RAM 提供）
  • 可编程无线电包括对 2-(G)FSK、4-(G)FSK、MSK、低功耗 Bluetooth® 5.2、IEEE 802.15.4 PHY 和 MAC 的支持
  • 支持无线升级 (OTA)

低功耗

  • MCU 功耗：
    • 3.60mA 有源模式，CoreMark
    • 61 μA/MHz（运行 CoreMark 时）
    • 0.8 μA 待机模式，RTC，32KB RAM
    • 0.1 μA 关断模式，引脚唤醒
  • 无线电功耗：
    • RX：6.8mA
    • TX：7.1mA（在 0dBm 条件下）
    • TX：9.6mA（在 +5dBm 条件下）

无线协议支持

高性能无线电

  • -104dBm（在 125kbps 低功耗 Bluetooth® 下）
  • 高达 +5dBm 的输出功率，具有温度补偿

法规遵从性

  • 经过监管认证，满足全球无线电频率要求：
    • ETSI RED（欧洲）/RER（英国）
    • ISED（加拿大）
    • FCC（美国）

MCU 外设

  • 数字外设可连接至任何 GPIO
  • 四个 32 位或八个 16 位通用计时器
  • 12 位 ADC、200ksps、8 通道
  • 8 位 DAC
  • 两个比较器
  • 可编程电流源
  • UART、SSI、I2C、I2S
  • 实时时钟 (RTC)
  • 集成温度和电池监控器

安全驱动工具

  • AES 128 位加密加速计
  • 真随机数发生器 (TRNG)
  • 软件开发套件 (SDK) 中提供了其他加密驱动器

开发工具和软件

工作温度范围

  • 片上降压直流/直流转换器
  • 1.8V 至 3.8V 单电源电压
  • Tj：-40°C 至 +105°C

封装

  • 7mm × 7mm MOU（32 个 GPIO）
  • 符合 RoHS 标准的封装