ZHCSF60K June   2016  – July 2020 BQ77904 , BQ77905

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Device Functionality Summary
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Protection Summary
      2. 8.3.2  Fault Operation
        1. 8.3.2.1  Operation in OV
        2. 8.3.2.2  Operation in UV
        3. 8.3.2.3  Operation in OW
        4. 8.3.2.4  Operation in OCD1
        5. 8.3.2.5  Operation in OCD2
        6. 8.3.2.6  Operation in SCD
        7. 8.3.2.7  Overcurrent Recovery Timer
        8. 8.3.2.8  Load Removal Detection
        9. 8.3.2.9  Load Removal Detection in UV
        10. 8.3.2.10 Operation in OTC
        11. 8.3.2.11 Operation in OTD
        12. 8.3.2.12 Operation in UTC
        13. 8.3.2.13 Operation in UTD
      3. 8.3.3  Protection Response and Recovery Summary
      4. 8.3.4  Configuration CRC Check and Comparator Built-In-Self-Test
      5. 8.3.5  Fault Detection Method
        1. 8.3.5.1 Filtered Fault Detection
      6. 8.3.6  State Comparator
      7. 8.3.7  DSG FET Driver Operation
      8. 8.3.8  CHG FET Driver Operation
      9. 8.3.9  External Override of CHG and DSG Drivers
      10. 8.3.10 Configuring 3-S, 4-S, or 5-S Mode
      11. 8.3.11 Stacking Implementations
      12. 8.3.12 Zero-Volt Battery Charging Inhibition
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
        1. 8.4.1.1 Power-On Reset (POR)
        2. 8.4.1.2 FAULT Mode
        3. 8.4.1.3 SHUTDOWN Mode
        4. 8.4.1.4 Customer Fast Production Test Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Recommended System Implementation
        1. 9.1.1.1 CHG and DSG FET Rise and Fall Time
        2. 9.1.1.2 Protecting CHG and LD
        3. 9.1.1.3 Protecting CHG FET
        4. 9.1.1.4 Using Load Detect for UV Fault Recovery
        5. 9.1.1.5 Temperature Protection
        6. 9.1.1.6 Adding Filter to Sense Resistor
        7. 9.1.1.7 Using a State Comparator in an Application
          1. 9.1.1.7.1 Examples
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Design Example
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision J (April 2020) to Revision K (July 2020)

Changes from Revision I (December 2019) to Revision J (February 2020)

  • Changed the BQ7790518 device to a catalog device in the Section 5 tableGo

Changes from Revision H (September 2018) to Revision I (December 2019)

Changes from Revision G (September 2017) to Revision H (September 2018)

  • 为简洁明了，更改了整个数据表中的一些措辞Go
  • Added the BQ7790518 device to the BQ77905 Section 5 table.Go

Changes from Revision F (May 2017) to Revision G (September 2017)

  • Added BQ7790511 and BQ7790512 to the Device Comparison table.Go

Changes from Revision E (March 2017) to Revision F (May 2017)

  • Changed the BQ7790400 setting: OV delay from 1 s to 2 s. UV from 2800 mV to 2200 mV, UV delay from 1 s to 2 s, UV Hyst from 200 to 400 mV, UV load recovery from N to Y. OCD2 from 80 mV to 60 mV, OCD2 delay from 700 to 350 ms. SCD from 160 mV to 100 mV.Go
  • Added BQ7790508 and BQ7790509 to the Device Comparison table.Go

Changes from Revision D (March 2017) to Revision E (March 2017)

  • Added BQ7790505 to the Device Comparison table.Go
  • Changed UTC(REC) at 5°C typ from 68.8 to 69.73 %VTB. Changed UTC(REC) at 10°C typ from 64.23 to 65.52 %VTBGo

Changes from Revision C (February 2017) to Revision D (March 2017)

  • Changed VOTD, VOTD(REC), VOTC, VOTC(REC), VUTD, VUTD(REC), VUTC, VUTC(REC) MIN and MAX specification valuesGo

Changes from Revision B (November 2016) to Revision C (February 2017)

  • Added values in the Thermal Information table to align with JEDEC standards.Go

Changes from Revision A (June 2016) to Revision B (November 2016)

  • 更改了特性 中所列项的顺序Go
  • Table 5-1 and Table 5-2, Changed OTC To: UTC in last column under Temperature. Changed BQ7790400 and BQ7790503 to Production Data. Updated the BQ7790503 configuration Go
  • Changed pin number from 16-pin to 20-pin Go
  • Corrected max value on the UTD at –20°C specGo
  • Changed comparator flowcharts with new flowchartsGo
  • Corrected CTRC and CTRD delay time entriesGo

Changes from Revision * (June 2016) to Revision A (June 2016)

  • 将器件从“产品预发布”更改为“量产”Go