ZHCSAI5C November   2012  – November 2021

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Electrical Characteristics: Supply Current
   6. 7.6  Digital Input and Output DC Characteristics
   7. 7.7  Power-on Reset
   8. 7.8  2.5-V LDO Regulator
   9. 7.9  Internal Clock Oscillators
   10. 7.10 ADC (Temperature and Cell Measurement) Characteristics
   11. 7.11 Integrating ADC (Coulomb Counter) Characteristics
   12. 7.12 Data Flash Memory Characteristics
   13. 7.13 I2C-Compatible Interface Communication Timing Requirements
   14. 7.14 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
   4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
         1. 8.4.1.1 BAT INSERT CHECK Mode
         2. 8.4.1.2 NORMAL Mode
         3. 8.4.1.3 SLEEP Mode
      2. 8.4.2 SLEEP+ Mode
      3. 8.4.3 HIBERNATE Mode
   5. 8.5 Programming
      1. 8.5.1 Standard Data Commands
      2. 8.5.2 Extended Data Commands
      3. 8.5.3 Communications
         1. 8.5.3.1 I2C Interface
         2. 8.5.3.2 I2C Time Out
         3. 8.5.3.3 I2C Command Waiting Time
         4. 8.5.3.4 I2C Clock Stretching
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
         1. 9.2.2.1 BAT Voltage Sense Input
         2. 9.2.2.2 SRP and SRN Current Sense Inputs
         3. 9.2.2.3 Sense Resistor Selection
         4. 9.2.2.4 TS Temperature Sense Input
         5. 9.2.2.5 Thermistor Selection
         6. 9.2.2.6 REGIN Power Supply Input Filtering
         7. 9.2.2.7 VCC LDO Output Filtering
      3. 9.2.3 Application Curves
10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Sense Resistor Connections
       2. 11.1.2 Thermistor Connections
       3. 11.1.3 High-Current and Low-Current Path Separation
    2. 11.2 Layout Example
12. 12Device and Documentation Support
    1. 12.1 第三方产品免责声明
    2. 12.2 Documentation Support
       1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
13. 13Mechanical, Packaging, and Orderable Information