ZHCSRC2A December   2022  – March 2024 AWRL6432

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. 功能方框图
  6. Device Comparison
    1. 5.1 Related Products
  7. Terminal Configurations and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
      1.      11
      2.      12
      3.      13
      4.      14
      5.      15
      6.      16
      7.      17
      8.      18
      9.      19
      10.      20
      11.      21
      12.      22
      13.      23
      14.      24
      15.      25
      16.      26
      17.      27
    3.     28
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
      1. 7.6.1 Power Optimized 3.3V I/O Topology
      2. 7.6.2 BOM Optimized 3.3V I/O Topology
      3. 7.6.3 Power Optimized 1.8V I/O Topology
      4. 7.6.4 BOM Optimized 1.8V I/O Topology
      5. 7.6.5 System Topologies
        1. 7.6.5.1 Power Topologies
          1. 7.6.5.1.1 BOM Optimized Mode
          2. 7.6.5.1.2 Power Optimized Mode
      6. 7.6.6 Internal LDO output decoupling capacitor and layout conditions for BOM optimized topology
        1. 7.6.6.1 Single-capacitor rail
          1. 7.6.6.1.1 1.2V Digital LDO
        2. 7.6.6.2 Two-capacitor rail
          1. 7.6.6.2.1 1.2V RF LDO
          2. 7.6.6.2.2 1.2V SRAM LDO
          3. 7.6.6.2.3 1.0V RF LDO
      7. 7.6.7 Noise and Ripple Specifications
    7. 7.7  Power Save Modes
      1. 7.7.1 Typical Power Consumption Numbers
    8. 7.8  Peak Current Requirement per Voltage Rail
    9. 7.9  RF Specification
    10. 7.10 Supported DFE Features
    11. 7.11 CPU Specifications
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 Timing and Switching Characteristics
      1. 7.13.1  Power Supply Sequencing and Reset Timing
      2. 7.13.2  Synchronized Frame Triggering
      3. 7.13.3  Input Clocks and Oscillators
        1. 7.13.3.1 Clock Specifications
      4. 7.13.4  MultiChannel buffered / Standard Serial Peripheral Interface (McSPI)
        1. 7.13.4.1 McSPI Features
        2. 7.13.4.2 SPI Timing Conditions
        3. 7.13.4.3 SPI—Controller Mode
          1. 7.13.4.3.1 Timing and Switching Requirements for SPI - Controller Mode
          2. 7.13.4.3.2 Timing and Switching Characteristics for SPI Output Timings—Controller Mode
        4. 7.13.4.4 SPI—Peripheral Mode
          1. 7.13.4.4.1 Timing and Switching Requirements for SPI - Peripheral Mode
          2. 7.13.4.4.2 Timing and Switching Characteristics for SPI Output Timings—Secondary Mode
      5. 7.13.5  RDIF Interface Configuration
        1. 7.13.5.1 RDIF Interface Timings
        2. 7.13.5.2 RDIF Data Format
      6. 7.13.6  LIN
      7. 7.13.7  General-Purpose Input/Output
        1. 7.13.7.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 7.13.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.13.8.1 Dynamic Characteristics for the CANx TX and RX Pins
      9. 7.13.9  Serial Communication Interface (SCI)
        1. 7.13.9.1 SCI Timing Requirements
      10. 7.13.10 Inter-Integrated Circuit Interface (I2C)
        1. 7.13.10.1 I2C Timing Requirements
      11. 7.13.11 Quad Serial Peripheral Interface (QSPI)
        1. 7.13.11.1 QSPI Timing Conditions
        2. 7.13.11.2 Timing Requirements for QSPI Input (Read) Timings
        3. 7.13.11.3 QSPI Switching Characteristics
      12. 7.13.12 JTAG Interface
        1. 7.13.12.1 JTAG Timing Conditions
        2. 7.13.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.13.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 功能方框图
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
      2. 8.3.2 Clock Subsystem
      3. 8.3.3 Transmit Subsystem
      4. 8.3.4 Receive Subsystem
      5. 8.3.5 Processor Subsystem
      6. 8.3.6 Automotive Interface
      7. 8.3.7 Host Interface
      8. 8.3.8 Application Subsystem Cortex-M4F
      9. 8.3.9 Hardware Accelerator (HWA1.2) Features
        1. 8.3.9.1 Hardware Accelerator Feature Differences Between HWA1.1 and HWA1.2
    4. 8.4 Other Subsystems
      1. 8.4.1 GPADC Channels (Service) for User Application
      2. 8.4.2 GPADC Parameters
    5. 8.5 Memory Partitioning Options
    6. 8.6 Boot Modes
  10. Monitoring and Diagnostics
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
  • AMF|102
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

AWRL6432 毫米波传感器器件是一款基于 FMCW 雷达技术的集成式单芯片毫米波传感器。该器件能够在 57GHz 至 63.9GHz 频段内运行,主要分为四个电源域:

  • 射频/模拟子系统:该块包含发送和接收射频信号所需的所有射频和模拟元件。
  • 前端控制器子系统 (FECSS):FECSS 包含负责雷达前端配置、控制和校准的处理器。
  • 应用子系统 (APPSS):在 APPSS 中,该器件实现了一个用户可编程的 ARM Cortex M4,允许自定义控制和汽车接口应用。顶部子系统 (TOPSS) 是 APPSS 电源域的一部分,包含时钟和电源管理子块。
  • 硬件加速器 (HWA):HWA 块通过卸载通用雷达处理(例如 FFT、恒定误报率 (CFAR)、缩放和压缩)来对 APPSS 进行补充。

AWRL6432 经过专门设计,可对上述每个电源域进行单独控制,因此可根据用例要求控制其状态(上电或断电)。该器件还具有运行各种低功耗状态(如睡眠和深度睡眠)的功能,其中低功耗睡眠模式是通过时钟门控和关闭器件的内部 IP 块来实现的。该器件还提供了保留器件某些内容的选项,例如在此类情况下保留的应用图像或射频配置文件。

此外,该器件采用 TI 的低功耗 45nm RF CMOS 工艺制造,以超小的外形尺寸实现了出色的集成度。AWRL6432 专为汽车领域的低功耗、自监控、超精确雷达系统而设计,适用于车内儿童检测、入侵监测、手势检测和占位检测等应用。

表 3-1 封装信息
量产器件型号(1) 封装 封装尺寸(2) 托盘/卷带包装

说明

AWRL6432BDBGAMFRQ1

AMF(FCCSP,102)

6.45mm x 6.45mm

卷带包装

汽车量产型号。以符合功能安全标准为目标。数量多
AWRL6432BDBGAMFQ1

AMF(FCCSP,102)

6.45mm x 6.45mm

托盘

汽车量产型号。以符合功能安全标准为目标。数量少
AWRL6432BDBAAMFRQ1 AMF(FCCSP,102) 6.45mm x 6.45mm 卷带包装 汽车量产型号。以符合功能安全标准为目标。数量多。支持经认证的引导。
AWRL6432BDBAAMFQ1

AMF(FCCSP,102)

6.45mm x 6.45mm 托盘 汽车量产型号。以符合功能安全标准为目标。数量少。支持经认证的引导
有关更多信息,请参阅节 13
有关更多信息,请参阅节 11.1