ZHCSPO3 March   2023 ADC34RF52

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Consumption
    6. 6.6  Electrical Characteristics - DC Specifications
    7. 6.7  Electrical Characteristics - AC Specifications (Dither DISABLED)
    8. 6.8  Electrical Characteristics - AC Specifications (Dither ENABLED)
    9. 6.9  Timing Requirements
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Input Bandwidth and Full-Scale
        2. 7.3.1.2 Input Imbalance
        3. 7.3.1.3 Overrange Indication
        4. 7.3.1.4 Analog out-of-band dither
      2. 7.3.2 Sampling Clock Input
      3. 7.3.3 SYSREF
        1. 7.3.3.1 SYSREF Capture Detection
      4. 7.3.4 ADC Foreground Calibration
        1. 7.3.4.1 Calibration Control
        2. 7.3.4.2 ADC Switch
        3. 7.3.4.3 Calibration Configuration
      5. 7.3.5 Decimation Filter
        1. 7.3.5.1 Decimation Filter Response
        2. 7.3.5.2 Decimation Filter Configuration
        3. 7.3.5.3 20-bit Output Mode
        4. 7.3.5.4 Numerically Controlled Oscillator (NCO)
        5. 7.3.5.5 NCO Frequency programming using the SPI interface
        6. 7.3.5.6 Fast Frequency Hopping
          1. 7.3.5.6.1 Fast frequency hopping using the GPIO1/2 pins
          2. 7.3.5.6.2 Fast frequency hopping using GPIO1/2, SEN and SDATA pins
          3. 7.3.5.6.3 Fast frequency hopping using the fast SPI
      6. 7.3.6 JESD204B Interface
        1. 7.3.6.1 JESD204B Initial Lane Alignment (ILA)
          1. 7.3.6.1.1 SYNC Signal
        2. 7.3.6.2 JESD204B Frame Assembly
          1. 7.3.6.2.1 JESD204B Frame Assembly in Bypass Mode
          2. 7.3.6.2.2 JESD204B Frame Assembly with Real Decimation - Single Band
          3. 7.3.6.2.3 JESD204B Frame Assembly with Decimation - Single Band
          4. 7.3.6.2.4 JESD204B Frame Assembly with Decimation - Dual Band
        3. 7.3.6.3 SERDES Output MUX
      7. 7.3.7 Test Pattern
        1. 7.3.7.1 Transport Layer
        2. 7.3.7.2 Link Layer
        3. 7.3.7.3 Internal Capture Memory Buffer
    4. 7.4 Device Functional Modes
      1. 7.4.1 Bypass Mode
      2. 7.4.2 Digital Averaging
    5. 7.5 Programming
      1. 7.5.1 GPIO Pin Control
      2. 7.5.2 Configuration using the SPI interface
        1. 7.5.2.1 Register Write
        2. 7.5.2.2 Register Read
    6. 7.6 Register Maps
      1. 7.6.1 Detailed Register Description
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Wideband RF Sampling Receiver
      2. 8.2.2 Design Requirements
        1. 8.2.2.1 Input Signal Path
        2. 8.2.2.2 Clocking
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Sampling Clock
      4. 8.2.4 Application Curves
    3. 8.3 Initialization Set Up
      1. 8.3.1 Initial Device Configuration After Power-Up
        1. 8.3.1.1  STEP 1: RESET
        2. 8.3.1.2  STEP 2: Device Configuration
        3. 8.3.1.3  STEP 3: JESD Interface Configuration (1)
        4. 8.3.1.4  STEP 4: SYSREF Synchronization
        5. 8.3.1.5  STEP 5: JESD Interface Configuration (2)
        6. 8.3.1.6  STEP 6: Analog Trim Settings
        7. 8.3.1.7  STEP 7: Calibration Configuration
        8. 8.3.1.8  STEP 8: SYSREF Synchronization
        9. 8.3.1.9  STEP 9: Run Power up Calibration
        10. 8.3.1.10 Step 10: JESD Interface Synchronization
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  10. 10Mechanical, Packaging, and Orderable Information

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8.4 Power Supply Recommendations

The ADC34RF52 requires four different power-supplies. The AVDD18, AVDD12 and CLKVDD rail provides power for the internal analog and clocking circuits of the ADC while the DVDD rail powers the digital logic (including averaging and decimation filter) and the JESD204B digital interface.

Power sequencing is required as shown in Initialization Set Up. The AVDD18, AVDD12 and especially the CLKVDD power supply must be low noise to achieve data sheet performance. For applications operating near DC, the 1/f noise contribution of the power supply needs to be considered as well.

Power supply decoupling capacitors (0.1 µF) as close to the pins as possible on the top layer are recommended.

GUID-20230215-SS0I-JKDF-XG7N-SMK2PZPDSHPB-low.svgFigure 8-9 Power supply rejection ratio (PSRR) vs frequency

The recommended power supply architecture for a low noise design is to first use a high-efficiency step down switching regular, followed by a second stage of regulation using a low noise LDO for each power rail as shown in Figure 8-10. This provides additional switching noise reduction and improved voltage accuracy.

TI WEBENCH® Power Designer can be used to select and design the individual power-supply elements. Recommended switching regulators for the first stage include the LMS3635, and similar devices. Recommended low dropout (LDO) linear regulators include the TPS7A8400, and similar devices.

GUID-20211021-SS0I-QZHK-QW96-25WK0JP3L9XP-low.svgFigure 8-10 Power supply design example

AVDD12 or CLKVDD should not be shared with the DVDD to prevent digital switching noise from coupling into the analog domain.