SBASAL2 November   2025 ADC32RF72

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - Power Consumption
    6. 5.6 Electrical Characteristics - DC Specifications
    7. 5.7 Electrical Characteristics - AC Specifications
    8. 5.8 Timing Requirements
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Input Bandwidth
        2. 7.3.1.2 Background Calibration
      2. 7.3.2 ADC Channel Selection and Power Down Modes
      3. 7.3.3 Sampling Clock Input
      4. 7.3.4 SYSREF
        1. 7.3.4.1 SYSREF Monitor
      5. 7.3.5 Digital Signal Processor (DSP) Features
        1. 7.3.5.1 DSP Input Mux
        2. 7.3.5.2 Fractional Delay
        3. 7.3.5.3 Programmable FIR Filter for Equalization
        4. 7.3.5.4 DSP Output Mux
        5. 7.3.5.5 Digital Down Converter (DDC)
          1. 7.3.5.5.1 Decimation Filter Input
          2. 7.3.5.5.2 Decimation Modes
          3. 7.3.5.5.3 Decimation Filter Response
          4. 7.3.5.5.4 Numerically Controlled Oscillator (NCO)
            1. 7.3.5.5.4.1 NCO Update
            2. 7.3.5.5.4.2 NCO RESET
      6. 7.3.6 Digital Output Interface
        1. 7.3.6.1 JESD204B/C Interface
          1. 7.3.6.1.1 JESD204B Initial Lane Alignment (ILA)
          2. 7.3.6.1.2 SYNC Signal
          3. 7.3.6.1.3 JESD204B/C Frame Assembly
          4. 7.3.6.1.4 JESD204B/C Frame Assembly in Bypass Mode
          5. 7.3.6.1.5 JESD204B/C Frame Assembly With Real Decimation
          6. 7.3.6.1.6 JESD204B,C Frame Assembly With Complex Decimation
        2. 7.3.6.2 JESD Output Reference Clock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Operating Mode Comparison
    5. 7.5 Programming
      1. 7.5.1 GPIO Control
      2. 7.5.2 SPI Register Write
      3. 7.5.3 SPI Register Read
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application: Spectrum Analyzer
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Input Signal Path: Wideband Receiver
        2. 8.2.1.2 Clocking
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Sampling Clock Requirements
      3. 8.2.3 Application Performance Plots
    3. 8.3 Typical Application: Time Domain Digitizer
      1. 8.3.1 Design Requirements
        1. 8.3.1.1 Input Signal Path: Time Domain Digitizer
      2. 8.3.2 Application Performance Plots
    4. 8.4 Initialization Set Up
    5. 8.5 Power Supply Recommendations
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
      2. 9.1.2 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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7.5.2 SPI Register Write

The internal registers can be programmed following these steps:

  1. Drive the SEN pin low (all SPI rising and falling clock edges need to occur while SEN driven low).
  2. Set the R/W bit to 0 (bit A15 of the 16-bit address).
  3. Initiate a serial interface cycle by specifying the address of the register (A[14:0]) whose content is written and
  4. Write the 8-bit data that are latched in on the SCLK rising edges

Figure 7-42 shows the timing requirements for the serial register write operation.

ADC32RF72 Serial Register Write Timing DiagramFigure 7-42 Serial Register Write Timing Diagram