ZHCSOJ3A march   2023  – may 2023 ADC12DJ5200SE

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC Specifications
    6. 6.6  Electrical Characteristics: Power Consumption
    7. 6.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 6.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Comparison
      2. 7.3.2  Analog Inputs
        1. 7.3.2.1 Analog Input Protection
        2. 7.3.2.2 Full-Scale Voltage (VFS) Adjustment
        3. 7.3.2.3 Analog Input Offset Adjust
      3. 7.3.3  ADC Core
        1. 7.3.3.1 ADC Theory of Operation
        2. 7.3.3.2 ADC Core Calibration
        3. 7.3.3.3 Analog Reference Voltage
        4. 7.3.3.4 ADC Overrange Detection
        5. 7.3.3.5 Code Error Rate (CER)
      4. 7.3.4  Temperature Monitoring Diode
      5. 7.3.5  Timestamp
      6. 7.3.6  Clocking
        1. 7.3.6.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 7.3.6.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 7.3.6.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 7.3.6.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 7.3.6.3.2 Automatic SYSREF Calibration
      7. 7.3.7  Programmable FIR Filter (PFIR)
        1. 7.3.7.1 Dual Channel Equalization
        2. 7.3.7.2 Single Channel Equalization
        3. 7.3.7.3 Time Varying Filter
      8. 7.3.8  Digital Down Converters (DDC)
        1. 7.3.8.1 Numerically-Controlled Oscillator and Complex Mixer
          1. 7.3.8.1.1 NCO Fast Frequency Hopping (FFH)
          2. 7.3.8.1.2 NCO Selection
          3. 7.3.8.1.3 Basic NCO Frequency Setting Mode
          4. 7.3.8.1.4 Rational NCO Frequency Setting Mode
          5. 7.3.8.1.5 NCO Phase Offset Setting
          6. 7.3.8.1.6 53
          7. 7.3.8.1.7 NCO Phase Synchronization
        2. 7.3.8.2 Decimation Filters
        3. 7.3.8.3 Output Data Format
        4. 7.3.8.4 Decimation Settings
          1. 7.3.8.4.1 Decimation Factor
          2. 7.3.8.4.2 DDC Gain Boost
      9. 7.3.9  JESD204C Interface
        1. 7.3.9.1 Transport Layer
        2. 7.3.9.2 Scrambler
        3. 7.3.9.3 Link Layer
        4. 7.3.9.4 8B/10B Link Layer
          1. 7.3.9.4.1 Data Encoding (8B/10B)
          2. 7.3.9.4.2 Multiframes and the Local Multiframe Clock (LMFC)
          3. 7.3.9.4.3 Code Group Synchronization (CGS)
          4. 7.3.9.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 7.3.9.4.5 Frame and Multiframe Monitoring
        5. 7.3.9.5 64B/66B Link Layer
          1. 7.3.9.5.1 64B/66B Encoding
          2. 7.3.9.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
          3. 7.3.9.5.3 Block, Multiblock and Extended Multiblock Alignment using Sync Header
            1. 7.3.9.5.3.1 Cyclic Redundancy Check (CRC) Mode
            2. 7.3.9.5.3.2 Forward Error Correction (FEC) Mode
          4. 7.3.9.5.4 Initial Lane Alignment
          5. 7.3.9.5.5 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 7.3.9.6 Physical Layer
          1. 7.3.9.6.1 SerDes Pre-Emphasis
        7. 7.3.9.7 JESD204C Enable
        8. 7.3.9.8 Multi-Device Synchronization and Deterministic Latency
        9. 7.3.9.9 Operation in Subclass 0 Systems
      10. 7.3.10 Alarm Monitoring
        1. 7.3.10.1 NCO Upset Detection
        2. 7.3.10.2 Clock Upset Detection
        3. 7.3.10.3 FIFO Upset Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dual-Channel Mode
      2. 7.4.2 Single-Channel Mode (DES Mode)
      3. 7.4.3 Dual-Input Single-Channel Mode (DUAL DES Mode)
      4. 7.4.4 JESD204C Modes
        1. 7.4.4.1 JESD204C Operating Modes Table
        2. 7.4.4.2 JESD204C Modes cont.
        3. 7.4.4.3 JESD204C Transport Layer Data Formats
        4. 7.4.4.4 64B/66B Sync Header Stream Configuration
        5. 7.4.4.5 Dual DDC and Redundant Data Mode
      5. 7.4.5 Power-Down Modes
      6. 7.4.6 Test Modes
        1. 7.4.6.1 Serializer Test-Mode Details
        2. 7.4.6.2 PRBS Test Modes
        3. 7.4.6.3 Clock Pattern Mode
        4. 7.4.6.4 Ramp Test Mode
        5. 7.4.6.5 Short and Long Transport Test Mode
          1. 7.4.6.5.1 Short Transport Test Pattern
          2. 7.4.6.5.2 Long Transport Test Pattern
        6. 7.4.6.6 D21.5 Test Mode
        7. 7.4.6.7 K28.5 Test Mode
        8. 7.4.6.8 Repeated ILA Test Mode
        9. 7.4.6.9 Modified RPAT Test Mode
      7. 7.4.7 Calibration Modes and Trimming
        1. 7.4.7.1 Foreground Calibration Mode
        2. 7.4.7.2 Background Calibration Mode
        3. 7.4.7.3 Low-Power Background Calibration (LPBG) Mode
      8. 7.4.8 Offset Calibration
      9. 7.4.9 Trimming
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Streaming Mode
    6. 7.6 SPI Register Map
  9. Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband RF Sampling Receiver
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input Signal Path
          2. 8.2.1.1.2 Clocking
        2. 8.2.1.2 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Power Sequencing
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • AAV|144
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power Supply Recommendations

The device requires two different power-supply voltages. 1.9-V DC is required for the VA19 power bus and 1.1-V DC is required for the VA11 and VD11 power buses. The power-supply voltages must be low noise and provide the needed current to achieve rated device performance. There are two recommended power supply architectures:

  1. Step down using high-efficiency switching converters, followed by a second stage of regulation to provide switching noise reduction and improved voltage accuracy.
  2. Directly step down the final ADC supply voltage using high-efficiency switching converters. This approach provides the best efficiency, but care must be taken for switching noise to be minimized to prevent degraded ADC performance. This approach is best described in the following application note: Powering Sensitive ADC Designs with the TPS62913 Low-Ripple and Low-Noise Buck Converter.

TI WEBENCH® Power Designer can be used to select and design the individual power supply elements needed: see the WEBENCH® Power Designer

  • Decouple all power supply rails and bus voltages as they come onto the system board and near/at the ADC itself. Typically, one decoupling capacitor per power supply pin is sufficent unless specified in the datasheet or EVM assembly.
  • Remember that approximately 20 dB/decade noise suppression is gained for each additional filtering stage.
  • Decouple for both high and low frequencies, which might require multiple capacitor values.
  • Series ferrite beads are commonly used at the power plain entry point. This should be done for each individual supply voltage on the system board whether it comes from an LDO or a switching regulator.
  • For added capacitance, use tightly stacked power and ground plane pairs (≤4 mil spacing) this adds inherent high-frequency (>500MHz) decoupling to the PCB design.
  • Keep supplies away from sensitive analog circuitry such as the front-end RF stage of the ADC and high-speed clocking & digital circuits if possible.
  • Some switcher regulator circuitry/components could be located on the opposite side of the PCB for added isolation.
  • Follow the IC manufacture recommendations; if they are not directly stated in the application note or data sheet, then study the evaluation board. These are great vehicles to learn from. Applying these points above can help provide a solid power supply design yielding datasheet performance in many applications.

Each application will have different tolerances for noise on the supply voltage so understanding these trades is best described in the following two application notes for more details:

  1. Clutter-free power supplies for RF converters in radar applications (Part 1)
  2. Clutter-free power supplies for RF converters in radar applications (Part 2)

Also refer to both Figure 8-5 and Figure 8-6 to illustrate a few different approaches.

GUID-20230224-SS0I-TRTK-7HCT-CF7B7FWPC3VD-low.svg
FB = ferrite bead filter.
Figure 8-5 LDO Linear Regulator Approach Example
GUID-20230224-SS0I-G8G4-ZVQM-LDGVTGKQD39T-low.svg
FB = ferrite bead filter.
Figure 8-6 Switcher-Only Approach Example