ZHCSNR6G June   1999  – March 2023 LM2576 , LM2576HV

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 3.3 V
    6. 6.6  Electrical Characteristics: 5 V
    7. 6.7  Electrical Characteristics: 12 V
    8. 6.8  Electrical Characteristics: 15 V
    9. 6.9  Electrical Characteristics: Adjustable Output Voltage
    10. 6.10 Electrical Characteristics: All Output Voltage Versions
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Delayed Start-Up
      3. 7.3.3 Adjustable Output, Low-Ripple Power Supply
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Current Limit
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Input Capacitor (CIN)
      2. 8.1.2  Inductor Selection
      3. 8.1.3  Inductor Ripple Current
      4. 8.1.4  Output Capacitor
      5. 8.1.5  Catch Diode
      6. 8.1.6  Output Voltage Ripple and Transients
      7. 8.1.7  Feedback Connection
      8. 8.1.8  ON /OFF INPUT
      9. 8.1.9  Inverting Regulator
      10. 8.1.10 Negative Boost Regulator
    2. 8.2 Typical Applications
      1. 8.2.1 Fixed Output Voltage Version
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection (L1)
          3. 8.2.1.2.3 Output Capacitor Selection (COUT)
          4. 8.2.1.2.4 Catch Diode Selection (D1)
          5. 8.2.1.2.5 Input Capacitor (CIN)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Adjusted Output Voltage Version
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Programming Output Voltage
          2. 8.2.2.2.2 Inductor Selection (L1)
          3. 8.2.2.2.3 Output Capacitor Selection (COUT)
          4. 8.2.2.2.4 Catch Diode Selection (D1)
          5. 8.2.2.2.5 Input Capacitor (CIN)
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Grounding
      4. 8.4.4 Heat Sink and Thermal Considerations
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
        1. 9.1.1.1 Definition of Terms
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design with WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 支持资源
    4. 9.4 接收文档更新通知
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NDH|5
  • NEB|5
  • KTT|5
  • KC|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)(2)(3)LM2576, LM2576HVUNIT
KTT (TO-263)KC (TO-220)
5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance42.632.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.341.2°C/W
RθJBJunction-to-board thermal resistance22.417.6°C/W
ψJTJunction-to-top characterization parameter10.77.8°C/W
ψJBJunction-to-board characterization parameter21.317°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance0.40.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953 and the Using New Thermal Metrics applications report, SBVA025.
(2) The package thermal impedance is calculated in accordance with JESD 51-7
(3) Thermal Resistances were simulated on a 4-layer, JEDEC board.