ZHCSNR6G 数据表 | 德州仪器 TI.com.cn

ZHCSNR6G June 1999 – March 2023 LM2576 , LM2576HV

PRODUCTION DATA

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

NDH|5
NEB|5
KTT|5
KC|5

散热焊盘机械数据 (封装 | 引脚)

KTT|5
- PPTD277

订购信息

6.11 Typical Characteristics

(Circuit of Figure 8-3 and Figure 8-9)

Figure 6-1 Normalized Output Voltage

Figure 6-3 Dropout Voltage

Figure 6-5 Quiescent Current

Figure 6-7 Oscillator Frequency

Figure 6-9 Efficiency

Figure 6-11 Quiescent Current vs Duty Cycle

Figure 6-13 Minimum Operating Voltage

Figure 6-15 Feedback Voltage vs Duty Cycle

If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PCB copper area thermally connected to the package. Using 0.5 square inches of copper area, θ_JA is 50°C/W, with 1 square inch of copper area, θ_JA is 37°C/W, and with 1.6 or more square inches of copper area, θ_JA is 32°C/W.

Figure 6-17 Maximum Power Dissipation (DDPAK/TO-263)

Figure 6-19 Load Transient Response

Figure 6-2 Line Regulation

Figure 6-4 Current Limit

Figure 6-6 Standby Quiescent Current

Figure 6-8 Switch Saturation Voltage

Figure 6-10 Minimum Operating Voltage

Figure 6-12 Feedback Voltage vs Duty Cycle

Figure 6-14 Quiescent Current vs Duty Cycle

Figure 6-16 Feedback Pin Current

V_OUT = 15 V A: Output Pin Voltage, 50 V/div B: Output Pin Current, 2 A/div C: Inductor Current, 2 A/div D: Output Ripple Voltage, 50 mV/div, AC-CoupledHorizontal Time Base: 5 μs/div

Figure 6-18 Switching Waveforms