ZHCSU80 December 2023 CC2340R2
PRODUCTION DATA
THERMAL METRIC | THERMAL METRIC | PACKAGE | UNIT | ||
---|---|---|---|---|---|
RGE (VQFN) |
|||||
24 PINS | |||||
RθJA | Junction-to-ambient thermal resistance | 40.1 | ℃/W (1) | ||
RθJC(top) | Junction-to-case (top) thermal resistance | 30.5 | ℃/W (1) | ||
RθJB | Junction-to-board thermal resistance | 17.2 | ℃/W (1) | ||
ψJT | Junction-to-top characterization parameter | 0.4 | ℃/W (1) | ||
ψJB | Junction-to-board characterization parameter | 17.1 | ℃/W (1) | ||
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.4 | ℃/W (1) |