ZHCSU80 December   2023 CC2340R2

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram – RGE Package (Top View)
    2. 6.2 Signal Descriptions – RGE Package
    3. 6.3 Connections for Unused Pins and Modules – RGE Package
    4. 6.4 RGE Peripheral Pin Mapping
    5. 6.5 RGE Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption - Power Modes
    10. 7.10 Power Consumption - Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy - Receive (RX)
    15. 7.15 Bluetooth Low Energy - Transmit (TX)
    16. 7.16 2.4 GHz RX/TX CW
    17. 7.17 Timing and Switching Characteristics
      1. 7.17.1 Reset Timing
      2. 7.17.2 Wakeup Timing
      3. 7.17.3 Clock Specifications
        1. 7.17.3.1 48 MHz Crystal Oscillator (HFXT)
        2. 7.17.3.2 48 MHz RC Oscillator (HFOSC)
        3. 7.17.3.3 32 kHz Crystal Oscillator (LFXT)
        4. 7.17.3.4 32 kHz RC Oscillator (LFOSC)
    18. 7.18 Peripheral Characteristics
      1. 7.18.1 UART
        1. 7.18.1.1 UART Characteristics
      2. 7.18.2 SPI
        1. 7.18.2.1 SPI Characteristics
        2. 7.18.2.2 SPI Controller Mode
        3. 7.18.2.3 SPI Timing Diagrams - Controller Mode
        4. 7.18.2.4 SPI Peripheral Mode
        5. 7.18.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 7.18.3 I2C
        1. 7.18.3.1 I2C
        2. 7.18.3.2 I2C Timing Diagram
      4. 7.18.4 GPIO
        1. 7.18.4.1 GPIO DC Characteristics
      5. 7.18.5 ADC
        1. 7.18.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.18.6 Comparators
        1. 7.18.6.1 Ultra-low power comparator
    19. 7.19 Typical Characteristics
      1. 7.19.1 MCU Current
      2. 7.19.2 RX Current
      3. 7.19.3 TX Current
      4. 7.19.4 RX Performance
      5. 7.19.5 TX Performance
      6. 7.19.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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7.18.2.2 SPI Controller Mode

Using TI SPI driver, over operating free-air temperature range (unless otherwise noted)
PARAMETERS TEST CONDITIONS MIN TYP MAX UNIT
tSCLK_H/L SCLK High or Low time (tSPI/2) - 1 tSPI/2 (tSPI/2) + 1 ns
tCS.LEAD CS lead-time, CS active to clock 1 SCLK
tCS.LAG CS lag time, Last clock to CS inactive 1 SCLK
tCS.ACC CS access time, CS active to PICO data out 1 SCLK
tCS.DIS CS disable time, CS inactive to PICO high impedance 1 SCLK
tVALID.CO PICO output data valid time(1) SCLK edge to PICO valid,CL = 20 pF 13 ns
tHD.CO PICO output data hold time(2) CL = 20 pF 0 ns
(1) Specifies the time to drive the next valid data to the output after the output changing SCLK clock edge
(2) Specifies how long data on the output is valid after the output changing SCLK clock edge