ZHCSU80 December   2023 CC2340R2

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 功能方框图
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram – RGE Package (Top View)
    2. 6.2 Signal Descriptions – RGE Package
    3. 6.3 Connections for Unused Pins and Modules – RGE Package
    4. 6.4 RGE Peripheral Pin Mapping
    5. 6.5 RGE Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption - Power Modes
    10. 7.10 Power Consumption - Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy - Receive (RX)
    15. 7.15 Bluetooth Low Energy - Transmit (TX)
    16. 7.16 2.4 GHz RX/TX CW
    17. 7.17 Timing and Switching Characteristics
      1. 7.17.1 Reset Timing
      2. 7.17.2 Wakeup Timing
      3. 7.17.3 Clock Specifications
        1. 7.17.3.1 48 MHz Crystal Oscillator (HFXT)
        2. 7.17.3.2 48 MHz RC Oscillator (HFOSC)
        3. 7.17.3.3 32 kHz Crystal Oscillator (LFXT)
        4. 7.17.3.4 32 kHz RC Oscillator (LFOSC)
    18. 7.18 Peripheral Characteristics
      1. 7.18.1 UART
        1. 7.18.1.1 UART Characteristics
      2. 7.18.2 SPI
        1. 7.18.2.1 SPI Characteristics
        2. 7.18.2.2 SPI Controller Mode
        3. 7.18.2.3 SPI Timing Diagrams - Controller Mode
        4. 7.18.2.4 SPI Peripheral Mode
        5. 7.18.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 7.18.3 I2C
        1. 7.18.3.1 I2C
        2. 7.18.3.2 I2C Timing Diagram
      4. 7.18.4 GPIO
        1. 7.18.4.1 GPIO DC Characteristics
      5. 7.18.5 ADC
        1. 7.18.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.18.6 Comparators
        1. 7.18.6.1 Ultra-low power comparator
    19. 7.19 Typical Characteristics
      1. 7.19.1 MCU Current
      2. 7.19.2 RX Current
      3. 7.19.3 TX Current
      4. 7.19.4 RX Performance
      5. 7.19.5 TX Performance
      6. 7.19.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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7.9 Power Consumption - Power Modes

When measured on the LP-EM-CC2340R5-RGE-4x4-IS24 reference design with Tc = 25 °C, VDDS = 3.0 V, DCDC enabled, GLDO disabled, unless otherwise noted. 
PARAMETER TEST CONDITIONS TYP UNIT
Core Current Consumption with DCDC
Icore Active MCU running CoreMark from Flash at 48 MHz  2.6 mA
Icore Active MCU running CoreMark from Flash at 48MHz  53 µA / MHz
Icore Idle Supply Systems and RAM powered, flash disabled, DMA disabled 
 0.8 mA
Icore Idle Supply Systems and RAM powered, flash disabled, DMA enabled 
 0.8 mA
Icore Idle Supply Systems and RAM powered, flash enabled, DMA disabled 
 1.1 mA
Icore Idle Supply Systems and RAM powered, flash enabled, DMA enabled 
 1.2 mA
Icore Standby RTC running, 28kB RAM retention
LFOSC, DCDC recharge current setting (ipeak = 1) 
 0.71 µA
Icore Standby RTC running, 28kB RAM retention
LFXT, DCDC recharge current setting (ipeak = 1)
 		 0.74 µA
Core Current consumption with GLDO
Icore Active MCU running CoreMark from Flash at 48 MHz  4.1 mA
Icore Idle Supply Systems and RAM powered, flash disabled, DMA disabled


 1.2 mA
Icore Idle Supply Systems and RAM powered, flash disabled, DMA enabled


 1.3 mA
Icore Idle Supply Systems and RAM powered, flash enabled, DMA disabled


 1.5 mA
Icore Idle Supply Systems and RAM powered, flash enabled, DMA enabled


 1.7 mA
Icore Standby RTC running, 28kB RAM retention  
LFOSC, default GLDO recharge current setting

1.1 µA
Icore Standby RTC running, 28kB RAM retention
LFXT default GLDO recharge current setting  		 1.15 µA
Reset, Shutdown Current Consumption
Icore Reset Reset. RSTN pin asserted or VDDS below power-on-reset threshold  165 nA
Icore Shutdown Shutdown measured in steady state. No clocks running, no retention, IO wakeup enabled 
 165 nA
Peripheral Current Consumption
Iperi RF Delta current, clock enabled, RF subsystem idle 40 µA
Iperi Timers Delta current with clock enabled, module is idle, one LGPT timer 2.4 µA
Iperi I2C Delta current with clock enabled, module is idle 10.6 µA
Iperi SPI Delta current with clock enabled, module is idle 3.4 µA
Iperi UART Delta current with clock enabled, module is idle 24.5 µA
Iperi CRYPTO (AES) Delta current with clock enabled, module is idle 3.8 µA