产品详情

Number of channels 1 Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 275 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 1 Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 275 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 SSOP (DCT) 8 11.8 mm² 2.95 x 4 UQFN (RSE) 8 2.25 mm² 1.5 x 1.5 VSSOP (DCU) 8 6.2 mm² 2 x 3.1
  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 1.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments

  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 1.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments

This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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技术文档

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 SN74AUC1G74 数据表 (Rev. D) 2007年 6月 25日
选择指南 Logic Guide (Rev. AC) PDF | HTML 2025年 11月 13日
应用手册 Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
选择指南 Little Logic Guide 2018 (Rev. G) 2018年 7月 6日
应用手册 How to Select Little Logic (Rev. A) 2016年 7月 26日
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
选择指南 逻辑器件指南 2014 (Rev. AA) 最新英语版本 (Rev.AC) PDF | HTML 2014年 11月 17日
选择指南 小尺寸逻辑器件指南 (Rev. E) 最新英语版本 (Rev.G) 2012年 7月 16日
用户指南 LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
应用手册 选择正确的电平转换解决方案 (Rev. A) 英语版 (Rev.A) 2006年 3月 23日
产品概述 Design Summary for WCSP Little Logic (Rev. B) 2004年 11月 4日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
用户指南 Signal Switch Data Book (Rev. A) 2003年 11月 14日
应用手册 Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices 2003年 3月 21日
用户指南 AUC Data Book, January 2003 (Rev. A) 2003年 1月 1日
应用手册 Texas Instruments Little Logic Application Report 2002年 11月 1日
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
更多文献资料 Standard Linear & Logic for PCs, Servers & Motherboards 2002年 6月 13日
更多文献资料 STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 2002年 3月 27日
更多文献资料 AUC Product Brochure (Rev. A) 2002年 3月 18日

设计与开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑评估模块

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
用户指南: PDF
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仿真模型

HSPICE MODEL OF SN74AUC1G74

SCEJ201.ZIP (94 KB) - HSpice Model
仿真模型

SN74AUC1G74 IBIS Model (Rev. A)

SCEM396A.ZIP (54 KB) - IBIS Model
封装 引脚 CAD 符号、封装和 3D 模型
DSBGA (YZP) 8 Ultra Librarian
SSOP (DCT) 8 Ultra Librarian
UQFN (RSE) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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