SN74AUP2G241
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption
(ICC = 0.9 µA Maximum) - Low Dynamic-Power Consumption
(Cpd = 4.2 pF Typ at 3.3 V) - Low Input Capacitance (Ci = 1.5 pF Typical)
- Low Noise – Overshoot and Undershoot
<10% of VCC - Ioff Supports Partial-Power-Down Mode Operation
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 9.9 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
NanoStar is a trademark of Texas Instruments
The AUP family is TIs premier solution to the industrys low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G241 is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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技术文档
类型 | 项目标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | SN74AUP2G241 Low-Power Dual Buffer/Driver With 3-State Outputs 数据表 (Rev. B) | 2010年 5月 18日 | |||
应用手册 | 了解施密特触发器 (Rev. A) | PDF | HTML | 下载英文版本 (Rev.A) | PDF | HTML | 2022年 12月 1日 | |
选择指南 | Little Logic Guide 2018 (Rev. G) | 2018年 7月 6日 | ||||
选择指南 | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||||
应用手册 | How to Select Little Logic (Rev. A) | 2016年 7月 26日 | ||||
选择指南 | 逻辑器件指南 2014 (Rev. AA) | 下载最新的英文版本 (Rev.AB) | 2014年 11月 17日 | |||
选择指南 | 小尺寸逻辑器件指南 (Rev. E) | 下载最新的英文版本 (Rev.G) | 2012年 7月 16日 | |||
应用手册 | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 |
设计和开发
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5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
封装 | 引脚数 | 下载 |
---|---|---|
DSBGA (YFP) | 8 | 了解详情 |
UQFN (RSE) | 8 | 了解详情 |
VSSOP (DCU) | 8 | 了解详情 |
X2SON (DQE) | 8 | 了解详情 |
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