封装信息
封装 | 引脚 VSON-CLIP (DQG) | 8 |
工作温度范围 (°C) -55 to 150 |
包装数量 | 包装 2,500 | LARGE T&R |
CSD16409Q3 的特性
- Ultra Low Qg and Qgd
- Low Thermal Resistance
- Avalanche Rated
- Pb Free Terminal Plating
- RoHS Compliant
- Halogen Free
- SON 3.3mm x 3.3mm Plastic Package
- APPLICATIONS
- Point-of-Load Synchronous Buck Converter for Applications
in Networking, Telecom and Computing Systems - Optimized for Control FET Applications
- Point-of-Load Synchronous Buck Converter for Applications
NexFET is a trademark of Texas Instruments.
CSD16409Q3 的说明
The NexFET™ power MOSFET has been designed to minimize losses in power conversion applications.