SWRU641 March   2026

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Temperature Range
    3. 2.3 Programming, Debug, and Control
      1. 2.3.1 Using a LaunchPad XDS110 Debug Probe
      2. 2.3.2 Using a Generic XDS110 Debug Probe, Including a Separate LaunchPad
    4. 2.4 Interfaces
      1. 2.4.1 XDS110 Interface Connector
      2. 2.4.2 Debug Interface Connector
    5. 2.5 Jumper Information
  9. 3Advanced Use of the LaunchPad Hardware
    1. 3.1 Conducted Measurements / External Antenna
  10. 4Software
    1. 4.1 Software Development
  11. 5Hardware Design Files
    1. 5.1 Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Compliance Information
    1. 6.1 CE Compliance
    2. 6.2 REACH Compliance
    3. 6.3 Waste Electrical and Electronic Equipment (WEEE) Compliance
  13. 7Additional Information
    1. 7.1 Trademarks
  14. 8References

Get Started

  1. Order the CC2662RQ1-BCU-EVM and either the LP-XDS110 or the LP-XDS110ET launch pad.
  2. Download the latest software development kit (SDK)
  3. Download the comprehensive reference design files from the TI reference design page.
  4. See the latest CC2662R-Q1 product page