SWRU641 March   2026

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Temperature Range
    3. 2.3 Programming, Debug, and Control
      1. 2.3.1 Using a LaunchPad XDS110 Debug Probe
      2. 2.3.2 Using a Generic XDS110 Debug Probe, Including a Separate LaunchPad
    4. 2.4 Interfaces
      1. 2.4.1 XDS110 Interface Connector
      2. 2.4.2 Debug Interface Connector
    5. 2.5 Jumper Information
  9. 3Advanced Use of the LaunchPad Hardware
    1. 3.1 Conducted Measurements / External Antenna
  10. 4Software
    1. 4.1 Software Development
  11. 5Hardware Design Files
    1. 5.1 Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Compliance Information
    1. 6.1 CE Compliance
    2. 6.2 REACH Compliance
    3. 6.3 Waste Electrical and Electronic Equipment (WEEE) Compliance
  13. 7Additional Information
    1. 7.1 Trademarks
  14. 8References

Features

  • 2 x CC2662R-Q1 wireless MCUs configured in a Dual Main Configuration
  • Each wireless MCU capable of up to +5dBm output power
  • 2 x TPS3436-Q1 watchdog device (1 per wireless MCU)
  • 2 x 2.4GHz PCB antenna with SMA connector for external antennas and conducted measurements (1 per wireless MCU)
  • 2 x 10-pin Arm®Cortex® connectors (1 per wireless MCU)
  • 2 x RF shield frames and covers (1 per wireless MCU, not required but included as an example layout to pass stringent EMI requirements)
  • 20-pin LP-EM Debug connector for a LaunchPad XDS110 Debugger (LP-XDS110 or LP-XDS110ET, sold separately and required for software development and RF evaluation)
  • Switch for LaunchPad XDS110 Debugger to wireless MCU interface selection
  • 6 LEDs (3 per wireless MCU)
  • Access to all I/O signals via dedicated 26 pin header (1 per wireless MCU)
  • I/O ESD protection TPD4E05U06-Q1
  • External power lugs