DesignDRIVE IDDK Hardware Reference Guide

Introduction

Trademarks

C2000, Delfino are registered trademarks of TI.

All other trademarks are the property of their respective owners.

Overview

The IDDK offers an integrated-drive design with a full-power stage to drive a 3-phase motor, easing evaluation of a diverse range of feedback sensing and control topologies. The kit includes a 180-pin HSEC controlCARD based on the TMS320F28379D C2000 Delfino™ MCU, which integrates dual C28x real-time processing cores and dual CLA real-time coprocessors that provide 800 MIPS of floating-point performance with integrated trigonometric and FFT acceleration.

The sophisticated sensing peripherals on the TMS320F28379D MCU include sigma-delta filter modules with up to eight input channels, four high-performance 16-bit ADCs, and eight windowed comparators. These peripherals enable the IDDK to support shunt, flux gate/HALL, and sigma-delta current sensing simultaneously. For position feedback, the IDDK leverages integrated MCU support for the resolver and incremental encoder interfaces. In addition, customers can also explore configuration options that place the MCU on either side of the high-voltage isolation barrier.

TI designed the kit to plug into 110-V/220-V AC mains, deliver up to 8 amps, and to drive motors to 1 horsepower.

This document covers the kit contents and hardware details and explains the functions and locations of various connector on the board. This document supersedes all the documents for the kit.

1 Getting Familiar With the Kit

1.1 Contents of the Kit

The kit consists of the following items:

• An IDDK EVM
• A TMDSCNCD28379D control processor
• A USB-A to USB Mini-B
• A PMSM motor for evaluation
  • The motor is not included with TMDXIDDK379D.
  • The motor is included with TMDXIDDKM379D bundle.
  • The motor is available stand-alone from the TI eStore. (The part number is HVPMSMMTR.)
• Items not included
  • An external, isolated power supply for developing code at low voltage

1.2 IDDK EVM Features

The EVM has the following features:

• Processor slots for control, real-time connectivity, and functional safety
• The Position Encoder Suite
• The Current Sensor Suite
• A high-voltage rectifier and inverter
• Power supplies
• Two digital-to-analog converters (DACs) to observe system variables on an oscilloscope for debugging
• The Hardware Developer’s Package (including schematics and bill of materials) is available through MotorControl SDK.

2 Hardware Overview

2.1 IDDK Evaluation Board

Figure 2-1 shows that the IDDK evaluation board is an open board without enclosures.

Figure 2-1 IDDK EVM Kit

The board can be divided into the following functional blocks:

• The processor (CPU) block for control, real-time connectivity, and functional safety
• The position encoder suite
• The current sensor suite
• The power inverter and rectifier
• Onboard power supplies

For experimentation, three GND planes are on the board: one plane is for safety and connectivity circuits, another plane is for control and interface, and a third plane is for high power circuits. Provisions are on the board to connect GND planes. If the control GND is tied to the power GND, ensure that position sensors and encoders connected to the board are properly grounded to earth.

2.2 Functional Blocks

Figure 2-2 shows the functional block diagram of the IDDK. Dedicated processors provide the system with control, real-time connectivity, and safety functions. The control processor has a suite of position encoder interfaces and current sense interfaces. You can configure the controller to select the interfaces you want. Table 2-1 shows that each block is subdivided into macros representing a subfunction.

Figure 2-2 Functional Block Diagram of IDDK

The following sections present each functional block and their macros. Figure 2-3 shows the layout of various macros in the board. Schematic details of the individual macros are available at \ti\c2000\C2000Ware_MotorControl_SDK_version\solutions\tmdxiddk379d\hardware\IDDK_HwDevPkg_r2.2.1.

Figure 2-3 Layout of IDDK EVM With Functional Macros

2.3 Processor Section

Figure 2-4 Processor Block

2.4 Control Processor Slot – H1

TI design the IDDK around the main control processor card in slot H1 to host a C2000 Delfino MCU control card such as TMDSCNCD28379D with an HSEC 180-pin edge connector. However, any other C2000 MCU control card could also be used as the basic pin outs are preserved, although there is a possibility of losing out on some functions depending on the MCU. Digital and analog feedback sensors and the inverter driver connect to this card to evaluate various motor control topologies.

2.5 Expansion Processor Slots

The IDDK supports two expansion control cards slots (H7 and H8) and the control processor slot (H1) for experimenting with the additional capabilities using the main drive control processor. In this release of IDDK, the interface connections among these H1, H7, and H8 connectors are base-level functions to achieve a minimum set of interactions. TI may improve or customize this capability in the later revisions of IDDK as required.

2.5.1 Real-time Connectivity – H7

Real-time connectivity is a necessity in many industrial drives. The control processor (H1) extends the SPI and McBSP signals and the isolated and nonisolated interface to the H7 connector. This processor slot allows real-time connectivity solutions (for example, EtherCAT, Ethernet, Profinet, and so forth) to communicate through SPI or McBSP to the control processor. TI will include application solutions for these functions in a future release of the IDDK.

2.5.2 Functional Safety – H8

Functional safety is mandatory for drives to ensure safety to both the machine and its operator. To implement IEC61800-5-2 drive safety functions, the H8 processor slot allows interface to critical control and sensing signals to the safety processor and to disable the power stage. Many topologies help achieve functional safety to comply with various safety levels. The processor slot lets the external safety module design meet functional safety functions. The control processor (H1) extends SPI interface signals to H8 to communicate with the functional safety processor available on the H8 slot. TI will explore application solutions with functional safety capabilities further in a future release of the IDDK.

2.6 Position Encoder Suite

Figure 2-5 Position Sensor Suite

The Position Encoder Suite provides a range of position encoder and sensing interfaces such as the following:

• QEP
• Resolver
• Sin-Cos
• EnDat / BiSS

TI designed each interface separately. All interfaces can be used simultaneously, except EnDat / BiSS. EnDat / BiSS cannot be used simultaneously without other interfaces because they share resources.

2.6.1 QEP

QEP is a macro (M10). The external interface to QEP is provided by header H2. Figure 2-6 shows the pinouts of the QEP interface.

Figure 2-6 QEP Interface Header

2.6.2 Resolver

Resolver is a macro (M11). Refer to the schematic at \ti\c2000\C2000Ware_MotorControl_SDK_version\solutions\tmdxiddk379d\hardware\IDDK_HwDevPkg_r2.2.1 for the interface amplifier configuration and gain settings. You can tweak these by modifying the appropriate resistors. The exciter winding amplifier can source and sink 45 mA. For a resolver needing more excitation current, use an external buffer. Figure 2-7 shows the External Interface Header (H3) and its pinouts.

Figure 2-7 Resolver Interface Header

2.6.3 Sin-Cos Encoder

The Sin-Cos Encoder is a macro (M13). This interface is similar to resolver interface because it processes the sine and cosine feedback signals from the encoder. Figure 2-8 shows the External Interface Header (H4) and its pinouts.

Figure 2-8 Sin-Cos Interface Header

2.6.4 BiSS / EnDat Encoder

The BiSS / EnDat Encoder is a macro (M12). This header is a common interface for both EnDat and BiSS encoders. Figure 2-9 shows the External Interface Header (H6) and how it interfaces with only digital signals. If the BiSS / EnDat encoder have Sin-Cos analog signals, connect them to the Sin-Cos Encoder Interface Header (H4).

Figure 2-9 EnDat / BiSS Interface Header

2.6.5 TI Design Interface Connector

The encoder signals are brought out on the H13 and H15 connectors and compatible for evaluation with position encoder TI designs such as Interface to an EnDat 2.2 Position Encoder (TIDU368).

2.7 Current Sensor Suite

This block provides a range of current sensor interfaces including the following:

• Shunt current sensing within an inverter block
• LEM flux gate or HALL current sensing
• Sigma-delta current sensing

This block also includes circuits to protect against overcurrent. See Figure 2-10 for further information.

Figure 2-10 Current Sensor Suite