SLVSIN8 June   2026 TPSM65660

ADVMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1  Input Voltage Range (VIN1, VIN2)
      2. 7.3.2  Internal LDO, VCC UVLO, and BIAS Input
      3. 7.3.3  Precision Enable and Adjustable Input Voltage UVLO (EN/UVLO)
      4. 7.3.4  Output Voltage Setpoint (FB, BIAS)
      5. 7.3.5  Adjustable Switching Frequency (RT)
      6. 7.3.6  Mode Selection and Clock Synchronization (MODE/SYNC)
        1. 7.3.6.1 Clock Synchronization
        2. 7.3.6.2 Clock Locking
      7. 7.3.7  Device Configuration (CNFG/SYNCOUT)
      8. 7.3.8  Dual Random Spread Spectrum (DRSS)
      9. 7.3.9  High-Side MOSFET Gate Drive (BST)
      10. 7.3.10 Soft Start and Recovery From Dropout
      11. 7.3.11 Protection Features
        1. 7.3.11.1 Power-Good Monitor
        2. 7.3.11.2 Overcurrent and Short-Circuit Protection
        3. 7.3.11.3 Hiccup-Mode Protection
        4. 7.3.11.4 Thermal Shutdown
      12. 7.3.12 Two-Phase, Single-Output Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Powertrain Components
        1. 8.1.1.1 Output Capacitors
        2. 8.1.1.2 Input Capacitors
        3. 8.1.1.3 EMI Filter
      2. 8.1.2 Error Amplifier and Compensation
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1 – 5V, 6A Synchronous Buck Regulator With Wide Input Voltage Range
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Choosing the Switching Frequency
          2. 8.2.1.2.2 Input Capacitor Selection
          3. 8.2.1.2.3 Output Capacitors
          4. 8.2.1.2.4 Output Voltage Setpoint
          5. 8.2.1.2.5 Compensation Components
          6. 8.2.1.2.6 Setting the Input Voltage UVLO
          7. 8.2.1.2.7 EMI Mitigation, RDRSS
          8. 8.2.1.2.8 Input Capacitor Selection
        3. 8.2.1.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Design and Layout
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
        1. 9.2.1.1 PCB Layout Resources
        2. 9.2.1.2 Thermal Design Resources
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
  • VCL|31
散热焊盘机械数据 (封装 | 引脚)

8.3 Best Design Practices

  • Do not exceed the Absolute Maximum Ratings.
  • Do not exceed the Recommended Operating Conditions.
  • Do not exceed the Section 6.2.
  • Do not leave EN/UVLO open circuit.
  • Follow all the guidelines and suggestions found in this data sheet before committing the design to production. TI application engineers are ready to help critique design and PCB layout to help make the project a success.