6.3 Thermal Information
THERMAL METRIC(1)
|
TPS84210 |
UNIT |
RKG (QFN) |
39 PINS |
θJA
|
Junction-to-ambient thermal resistance(2)
|
12 |
°C/W |
ψJT
|
Junction-to-top characterization parameter(3)
|
2.2 |
°C/W |
ψJB
|
Junction-to-board characterization parameter(4)
|
9.7 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report,
SPRA953.
(2) The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with 1 oz. copper and natural convection cooling. Additional airflow reduces θJA.
(3) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.