ZHCSQ77A February   2023  – September 2023 TPS25948

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 8.3.2 Overvoltage Lockout (OVLO)
      3. 8.3.3 Inrush Current, Overcurrent, and Short Circuit Protection
        1. 8.3.3.1 Slew Rate (dVdt) and Inrush Current Control
        2. 8.3.3.2 Active Current Limiting
        3. 8.3.3.3 Short-Circuit Protection
      4. 8.3.4 Analog Load Current Monitor
      5. 8.3.5 Reverse Current Protection
      6. 8.3.6 Overtemperature Protection (OTP)
      7. 8.3.7 Fault Response and Indication (FLT)
      8. 8.3.8 Supply Good Indication (SPLYGD/SPLYGD)
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Single Device, Self-Controlled
    3. 9.3 Typical Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Setting Overvoltage Threshold
        2. 9.3.2.2 Setting Output Voltage Rise Time (tR)
        3. 9.3.2.3 Setting Overcurrent Threshold (ILIM)
        4. 9.3.2.4 Setting Overcurrent Blanking Interval (tITIMER)
      3. 9.3.3 Application Curves
    4. 9.4 Active ORing
    5. 9.5 Priority Power MUXing
    6. 9.6 Parallel Operation
    7. 9.7 USB PD Port Protection
    8. 9.8 Power Supply Recommendations
      1. 9.8.1 Transient Protection
      2. 9.8.2 Output Short-Circuit Measurements
    9. 9.9 Layout
      1. 9.9.1 Layout Guidelines
      2. 9.9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

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Transient Protection

In the case of a short-circuit and overload current limit when the device interrupts current flow, the input inductance generates a positive voltage spike on the input, and the output inductance generates a negative voltage spike on the output. The peak amplitude of voltage spikes (transients) is dependent on the value of inductance in series to the input or output of the device. Such transients can exceed the absolute maximum ratings of the device if steps are not taken to address the issue. Typical methods for addressing transients include:

  • Minimize lead length and inductance into and out of the device.
  • Use a large PCB GND plane.
  • Connect a Schottky diode from the OUT pin ground to absorb negative spikes.
  • Connect a low ESR capacitor larger than 1 μF at the OUT pin very close to the device.
  • Use a low-value ceramic capacitor CIN = 1 μF to absorb the energy and dampen the transients. The capacitor voltage rating should be atleast twice the input supply voltage to be able to withstand the positive voltage excursion during inductive ringing.

    The approximate value of input capacitance can be estimated with the equation:

    Equation 19. VSPIKE(ABSOLUTE)  = VIN +ILOAD × LINCIN 

    where

    • VIN is the nominal supply voltage.
    • • ILOAD is the load current.
    • LIN equals the effective inductance seen looking into the source.
    • CIN is the capacitance present at the input.
  • Some applications may require the addition of a Transient Voltage Suppressor (TVS) to prevent transients from exceeding the absolute maximum ratings of the device. In some cases, even if the maximum amplitude of the transients is below the absolute maximum rating of the device, a TVS can help to absorb the excessive energy dump and prevent it from creating very fast transient voltages on the input supply pin of the IC, which can couple to the internal control circuits and cause unexpected behavior.
  • For applications such as USB-C ports where a powered cable can be plugged to the output of the device, there could be excess voltage stress from OUT to IN which exceeds the absolute maximum rating of the device. It's recommended to add a TVS diode from OUT to IN to clamp the voltage to a safe level.

The circuit implementation with optional protection components is shown in Figure 9-23.

GUID-20230914-SS0I-QVB2-9KVL-FNSJFPSFNCJG-low.svgFigure 9-23 Circuit Implementation with Optional Protection Components