ZHCSA13P November   2008  – February 2021 TMS320F28020 , TMS320F280200 , TMS320F28021 , TMS320F28022 , TMS320F28023 , TMS320F28023-Q1 , TMS320F28026 , TMS320F28026-Q1 , TMS320F28026F , TMS320F28027 , TMS320F28027-Q1 , TMS320F28027F , TMS320F28027F-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图‎
  5. 5 修订历史记录
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 引脚图
    2. 7.2 信号说明
      1. 7.2.1 信号说明
  8. 8 规格
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD 等级 - 汽车
    3. 8.3  ESD 等级 - 商用
    4. 8.4  建议工作条件
    5. 8.5  功耗摘要
      1. 8.5.1 TMS320F2802x/F280200 在 40MHz SYSCLKOUT 下的电流消耗
      2. 8.5.2 TMS320F2802x 在 50MHz SYSCLKOUT 下的电流消耗
      3. 8.5.3 TMS320F2802x 在 60MHz SYSCLKOUT 下的电流消耗
      4. 8.5.4 Reducing Current Consumption
      5. 8.5.5 流耗图（VREG 启用）
    6. 8.6  电气特性
    7. 8.7  热阻特性
      1. 8.7.1 PT 封装
      2. 8.7.2 DA 封装
    8. 8.8  散热设计注意事项
    9. 8.9  无信号缓冲情况下 MCU 与 JTAG 调试探针的连接
    10. 8.10 参数信息
      1. 8.10.1 时序参数符号
      2. 8.10.2 定时参数的通用注释
    11. 8.11 测试负载电路
    12. 8.12 电源时序
      1. 8.12.1 复位 (XRS) 时序要求
      2. 8.12.2 复位 (XRS) 开关特性
    13. 8.13 时钟规范
      1. 8.13.1 器件时钟表
        1. 8.13.1.1 2802x 时钟表和命名规则（40MHz 器件）
        2. 8.13.1.2 2802x 时钟表和命名规则（50MHz 器件）
        3. 8.13.1.3 2802x时钟表和命名规则（60MHz 器件）
        4. 8.13.1.4 器件计时要求/特性
        5. 8.13.1.5 内部零引脚振荡器 (INTOSC1/INTOSC2) 特性
      2. 8.13.2 时钟要求和特性
        1. 8.13.2.1 XCLKIN 定时要求 - PLL 已启用
        2. 8.13.2.2 XCLKIN 时序要求 - PLL 已禁用
        3. 8.13.2.3 XCLKOUT 开关特性（旁路或启用 PLL）
    14. 8.14 闪存定时
      1. 8.14.1 T 温度材料的闪存/OTP 耐久性
      2. 8.14.2 S 温度材料的闪存/OTP 耐久性
      3. 8.14.3 Q 温度材料的闪存/OTP 耐久性
      4. 8.14.4 60MHz SYSCLKOUT 下的闪存参数
      5. 8.14.5 50MHz SYSCLKOUT 上的闪存参数：
      6. 8.14.6 40MHz SYSCLKOUT 上的闪存参数：
      7. 8.14.7 闪存编程/擦除时间
      8. 8.14.8 闪存 / OTP 访问时序
      9. 8.14.9 Flash Data Retention Duration
  9. 9 详细说明
    1. 9.1 Overview
      1. 9.1.1  CPU
      2. 9.1.2  Memory Bus (Harvard Bus Architecture)
      3. 9.1.3  外设总线
      4. 9.1.4  Real-Time JTAG and Analysis
      5. 9.1.5  Flash
      6. 9.1.6  M0，M1 SARAM
      7. 9.1.7  L0 SARAM
      8. 9.1.8  Boot ROM
        1. 9.1.8.1 仿真引导
        2. 9.1.8.2 GetMode
        3. 9.1.8.3 引导加载器使用的外设引脚
      9. 9.1.9  Security
      10. 9.1.10 外设中断扩展 (PIE) 块
      11. 9.1.11 外部中断 (XINT1-XINT3)
      12. 9.1.12 内部零引脚振荡器、振荡器和 PLL
      13. 9.1.13 看门狗
      14. 9.1.14 Peripheral Clocking
      15. 9.1.15 Low-power Modes
      16. 9.1.16 外设帧 0，1，2 (PFn)
      17. 9.1.17 通用输入/输出 (GPIO) 复用器
      18. 9.1.18 32 位 CPU 定时器 (0，1，2)
      19. 9.1.19 Control Peripherals
      20. 9.1.20 串行端口外设
    2. 9.2 Memory Maps
    3. 9.3 Register Maps
    4. 9.4 Device Emulation Registers
    5. 9.5 VREG/BOR/POR
      1. 9.5.1 片载电压稳压器 (VREG)
        1. 9.5.1.1 使用片上 VREG
        2. 9.5.1.2 禁用片载 VREG
      2. 9.5.2 On-chip Power-On Reset (POR) and Brown-Out Reset (BOR) Circuit
    6. 9.6 系统控制
      1. 9.6.1 内部零引脚振荡器
      2. 9.6.2 Crystal Oscillator Option
      3. 9.6.3 PLL-Based Clock Module
      4. 9.6.4 输入时钟的损耗（NMI 看门狗功能）
      5. 9.6.5 CPU 看门狗模块
    7. 9.7 Low-power Modes Block
    8. 9.8 Interrupts
      1. 9.8.1 External Interrupts
        1. 9.8.1.1 外部中断电子数据/定时
          1. 9.8.1.1.1 External Interrupt Timing Requirements
          2. 9.8.1.1.2 External Interrupt Switching Characteristics
    9. 9.9 外设
      1. 9.9.1  Analog Block
        1. 9.9.1.1 模数转换器 (ADC)
          1. 9.9.1.1.1 特性
          2. 9.9.1.1.2 ADC 转换开始电子数据/定时
            1. 9.9.1.1.2.1 外部 ADC 转换启动开关特性
          3. 9.9.1.1.3 片载模数转换器 (ADC) 电子数据/定时
            1. 9.9.1.1.3.1 ADC Electrical Characteristics
            2. 9.9.1.1.3.2 ADC 电源模式
            3. 9.9.1.1.3.3 内部温度传感器
              1. 9.9.1.1.3.3.1 Temperature Sensor Coefficient
            4. 9.9.1.1.3.4 ADC 加电控制位时序
              1. 9.9.1.1.3.4.1 ADC 加电延迟
            5. 9.9.1.1.3.5 ADC 顺序模式时序和同步模式时序
        2. 9.9.1.2 ADC 多路复用器
        3. 9.9.1.3 比较器块
          1. 9.9.1.3.1 片载比较器 / DAC 电子数据/定时
            1. 9.9.1.3.1.1 Electrical Characteristics of the Comparator/DAC
      2. 9.9.2  详细说明
      3. 9.9.3  Serial Peripheral Interface (SPI) Module
        1. 9.9.3.1 SPI 主模式电气数据/时序
          1. 9.9.3.1.1 SPI Master Mode External Timing (Clock Phase = 0)
          2. 9.9.3.1.2 SPI Master Mode External Timing (Clock Phase = 1)
        2. 9.9.3.2 SPI 从模式电气数据/时序
          1. 9.9.3.2.1 SPI Slave Mode External Timing (Clock Phase = 0)
          2. 9.9.3.2.2 SPI Slave Mode External Timing (Clock Phase = 1)
      4. 9.9.4  Serial Communications Interface (SCI) Module
      5. 9.9.5  Inter-Integrated Circuit (I2C)
        1. 9.9.5.1 I2C 电气数据/时序
          1. 9.9.5.1.1 I2C 时序要求
          2. 9.9.5.1.2 I2C 开关特性
      6. 9.9.6  Enhanced PWM Modules (ePWM1/2/3/4)
        1. 9.9.6.1 ePWM 电气数据/时序
          1. 9.9.6.1.1 ePWM Timing Requirements
          2. 9.9.6.1.2 ePWM 开关特性
        2. 9.9.6.2 触发区输入时序
          1. 9.9.6.2.1 Trip-Zone Input Timing Requirements
      7. 9.9.7  High-Resolution PWM (HRPWM)
        1. 9.9.7.1 HRPWM 电气数据/时序
          1. 9.9.7.1.1 SYSCLKOUT = 50MHz–60MHz 下的高分辨率 PWM 特性
      8. 9.9.8  Enhanced Capture Module (eCAP1)
        1. 9.9.8.1 eCAP 电气数据/时序
          1. 9.9.8.1.1 Enhanced Capture (eCAP) Timing Requirement
          2. 9.9.8.1.2 eCAP 开关特性
      9. 9.9.9  JTAG 端口
      10. 9.9.10 General-Purpose Input/Output (GPIO) MUX
        1. 9.9.10.1 GPIO 电气数据/时序
          1. 9.9.10.1.1 GPIO - 输出时序
            1. 9.9.10.1.1.1 通用输出开关特性
          2. 9.9.10.1.2 GPIO - 输入时序
            1. 9.9.10.1.2.1 通用输入时序要求
          3. 9.9.10.1.3 针对输入信号的采样窗口宽度
          4. 9.9.10.1.4 低功耗唤醒时序
            1. 9.9.10.1.4.1 IDLE Mode Timing Requirements
            2. 9.9.10.1.4.2 IDLE Mode Switching Characteristics
            3. 9.9.10.1.4.3 待机模式时序要求
            4. 9.9.10.1.4.4 待机模式开关特性
            5. 9.9.10.1.4.5 HALT Mode Timing Requirements
            6. 9.9.10.1.4.6 停机模式开关特性
  10. 10应用、实施和布局
    1. 10.1 TI 参考设计
  11. 11器件和文档支持
    1. 11.1 Device and Development Support Tool Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 文档支持
    4. 11.4 支持资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息
    1. 12.1 封装信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.9.4 Serial Communications Interface (SCI) Module

The devices include one serial communications interface (SCI) module (SCI-A). The SCI module supports digital communications between the CPU and other asynchronous peripherals that use the standard nonreturn-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each has its own separate enable and interrupt bits. Both can be operated independently or simultaneously in the full-duplex mode. To ensure data integrity, the SCI checks received data for break detection, parity, overrun, and framing errors. The bit rate is programmable to over 65000 different speeds through a 16-bit baud-select register.

Features of each SCI module include:

  • Two external pins:
    • SCITXD: SCI transmit-output pin
    • SCIRXD: SCI receive-input pin
      Note:

      Both pins can be used as GPIO if not used for SCI.

    • Baud rate programmable to 64K different rates:
    GUID-04B33BF4-CB7E-47FD-9A8C-910D505DE881-low.gif
  • Data-word format
    • One start bit
    • Data-word length programmable from 1 to 8 bits
    • Optional even/odd/no parity bit
    • One or 2 stop bits
  • Four error-detection flags: parity, overrun, framing, and break detection
  • Two wake-up multiprocessor modes: idle-line and address bit
  • Half- or full-duplex operation
  • Double-buffered receive and transmit functions
  • Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with status flags.
    • Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX EMPTY flag (transmitter-shift register is empty)
    • Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag (break condition occurred), and RX ERROR flag (monitoring four interrupt conditions)
  • Separate enable bits for transmitter and receiver interrupts (except BRKDT)
  • NRZ (nonreturn-to-zero) format
    Note:

    All registers in this module are 8-bit registers that are connected to Peripheral Frame 2. When a register is accessed, the register data is in the lower byte (7–0), and the upper byte (15–8) is read as zeros. Writing to the upper byte has no effect.

Enhanced features:

  • Auto baud-detect hardware logic
  • 4-level transmit/receive FIFO

The SCI port operation is configured and controlled by the registers listed in Table 9-25.

Table 9-25 SCI-A Registers
NAME(1)ADDRESSSIZE (x16)EALLOW PROTECTEDDESCRIPTION
SCICCRA0x70501NoSCI-A Communications Control Register
SCICTL1A0x70511NoSCI-A Control Register 1
SCIHBAUDA0x70521NoSCI-A Baud Register, High Bits
SCILBAUDA0x70531NoSCI-A Baud Register, Low Bits
SCICTL2A0x70541NoSCI-A Control Register 2
SCIRXSTA0x70551NoSCI-A Receive Status Register
SCIRXEMUA0x70561NoSCI-A Receive Emulation Data Buffer Register
SCIRXBUFA0x70571NoSCI-A Receive Data Buffer Register
SCITXBUFA0x70591NoSCI-A Transmit Data Buffer Register
SCIFFTXA(2)0x705A1NoSCI-A FIFO Transmit Register
SCIFFRXA(2)0x705B1NoSCI-A FIFO Receive Register
SCIFFCTA(2)0x705C1NoSCI-A FIFO Control Register
SCIPRIA0x705F1NoSCI-A Priority Control Register
(1) Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce undefined results.
(2) These registers are new registers for the FIFO mode.

For more information on the SCI, see the Serial Communications Interface (SCI) chapter in the TMS320F2802x,TMS320F2802xx Technical Reference Manual.

Figure 9-33 shows the SCI module block diagram.

GUID-44AFDE94-DD95-4C1C-ADBF-E13F50D53FE2-low.gifFigure 9-33 Serial Communications Interface (SCI) Module Block Diagram