ZHCSJ85F June   2005  – January 2023 TMP300

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Calculating RSET
      2. 7.2.2 Using VTEMP to Trip the Digital Output
      3. 7.2.3 Analog Temperature Output
      4. 7.2.4 Using a DAC to Set the Trip Point
      5. 7.2.5 Hysteresis
  8. 8Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 术语表
  9. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision E (December 2018) to Revision F (January 2023)

  • 更新了整个文档的表、图和交叉参考的编号格式Go
  • 器件信息 表更改为封装信息 Go
  • Added parameter to the Absolute Maximum Ratings table: input current into any pinGo

Changes from Revision D (January 2016) to Revision E (December 2018)

  • Added Pin Configuration and Functions section Go

Changes from Revision C (January 2011) to Revision D (January 2016)

  • 添加了器件信息 表、ESD 等级 表、特性说明 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • 更改了温度范围 特性要点Go
  • 向引脚排列部分添加了封装名称Go
  • Deleted Ordering Information table Go
  • Changed Temperature Range, TA, Functional Range parameter name in Electrical Characteristics tableGo
  • Added footnote 4 to Electrical Characteristics table Go

Changes from Revision B (November 2008) to Revision C (January 2011)

  • 删除了说明 部分的第二句Go
  • Added TMP300B grade device specifications to Electrical Characteristics tableGo