ZHCSEG6F December   2015  – May 2025 TCAN330 , TCAN330G , TCAN332 , TCAN332G , TCAN334 , TCAN334G , TCAN337 , TCAN337G

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5.   Device Options
  6. 4Pin Configuration and Functions
  7. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
    8. 5.8 Typical Characteristics, TCAN330 Receiver
    9. 5.9 Typical Characteristics, TCAN330 Driver
  8.   Parameter Measurement Information
  9. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 TXD Dominant Timeout (TXD DTO)
      2. 6.3.2 RXD Dominant Timeout (RXD DTO)
      3. 6.3.3 Thermal Shutdown
      4. 6.3.4 Undervoltage Lockout and Unpowered Device
      5. 6.3.5 Fault Pin (TCAN337)
      6. 6.3.6 Floating Pins
      7. 6.3.7 CAN Bus Short Circuit Current Limiting
      8. 6.3.8 ESD Protection
      9. 6.3.9 Digital Inputs and Outputs
    4. 6.4 Device Functional Modes
      1. 6.4.1 CAN Bus States
      2. 6.4.2 Normal Mode
      3. 6.4.3 Silent Mode
      4. 6.4.4 Standby Mode with Wake
      5. 6.4.5 Bus Wake via RXD Request (BWRR) in Standby Mode
      6. 6.4.6 Shutdown Mode
      7. 6.4.7 Driver and Receiver Function Tables
  10. 7Application Information Disclaimer
    1. 7.1 Application Information
      1. 7.1.1 Bus Loading, Length and Number of Nodes
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 CAN Termination
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 System Examples
      1. 7.3.1 ISO11898 Compliance of TCAN33x Family of 3.3V CAN Transceivers Introduction
      2. 7.3.2 Differential Signal
      3. 7.3.3 Common-Mode Signal and EMC Performance
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  11.   Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 商标
    4. 8.4 静电放电警告
    5. 8.5 术语表
  12. 8Revision History
  13. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8 Revision History

Changes from Revision E (December 2019) to Revision F (May 2025)

  • 将“器件信息”表更改为封装信息 表Go

Changes from Revision D (April 2016) to Revision E (December 2019)

Changes from Revision C (April 2016) to Revision D (April 2016)

  • 将将 节 2 列表中的 ARNIC825 更改为 ARINC825Go

Changes from Revision B (April 2016) to Revision C (April 2016)

  • Removed the Preview Note from TCAN337 and TCAN337G in the Device Options tableGo

Changes from Revision A (January 2016) to Revision B (April 2016)

  • Removed the Preview Note from all device except for TCAN337 and TCAN337G in the Device Comparison tableGo
  • Changed FAULT Pin ICL MIN value From: 5mA To: 4mA in the Section 5.5 Go

Changes from Revision * (December 2015) to Revision A (January 2016)

  • 将 节 1 从“总环路延迟 < 150ns” 至：“总环路延迟 < 135ns”Go
  • Changed VIT(SLEEP) To: VIT(STB) and added Test conditions in the Section 5.5 Go
  • Added –12V < VCM < 12V to tWK_FILTER in the Test Conditions of Section 5.6 Go