ZHCSEG6F December   2015  – May 2025 TCAN330 , TCAN330G , TCAN332 , TCAN332G , TCAN334 , TCAN334G , TCAN337 , TCAN337G

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5.   Device Options
  6. 4Pin Configuration and Functions
  7. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
    8. 5.8 Typical Characteristics, TCAN330 Receiver
    9. 5.9 Typical Characteristics, TCAN330 Driver
  8.   Parameter Measurement Information
  9. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 TXD Dominant Timeout (TXD DTO)
      2. 6.3.2 RXD Dominant Timeout (RXD DTO)
      3. 6.3.3 Thermal Shutdown
      4. 6.3.4 Undervoltage Lockout and Unpowered Device
      5. 6.3.5 Fault Pin (TCAN337)
      6. 6.3.6 Floating Pins
      7. 6.3.7 CAN Bus Short Circuit Current Limiting
      8. 6.3.8 ESD Protection
      9. 6.3.9 Digital Inputs and Outputs
    4. 6.4 Device Functional Modes
      1. 6.4.1 CAN Bus States
      2. 6.4.2 Normal Mode
      3. 6.4.3 Silent Mode
      4. 6.4.4 Standby Mode with Wake
      5. 6.4.5 Bus Wake via RXD Request (BWRR) in Standby Mode
      6. 6.4.6 Shutdown Mode
      7. 6.4.7 Driver and Receiver Function Tables
  10. 7Application Information Disclaimer
    1. 7.1 Application Information
      1. 7.1.1 Bus Loading, Length and Number of Nodes
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 CAN Termination
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 System Examples
      1. 7.3.1 ISO11898 Compliance of TCAN33x Family of 3.3V CAN Transceivers Introduction
      2. 7.3.2 Differential Signal
      3. 7.3.3 Common-Mode Signal and EMC Performance
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  11.   Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 商标
    4. 8.4 静电放电警告
    5. 8.5 术语表
  12. 8Revision History
  13. 9Mechanical, Packaging, and Orderable Information

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6.3.6 Floating Pins

The device has internal pull ups and pull downs on critical terminals to place the device into known states if the pin floats. See Table 6-1 for details on pin bias conditions.

Table 6-2 Pin Bias
PINPULL UP or PULL DOWNCOMMENT
TXDPull upWeakly biases TXD toward recessive to prevent bus blockage or TXD DTO triggering.
STBPull downWeakly biases STB terminal towards normal mode.
SPull downWeakly biases S terminal towards normal mode.
SHDNPull downWeakly biases SHDN terminal towards normal mode.

The internal bias should not be relied on by design, especially in noisy environments, but should be considered a fall back protection. Special care needs to be taken when the device is used with MCUs using open drain outputs. TXD is weakly internally pulled up. The TXD pull up strength and CAN bit timing require special consideration when this device is used with an open drain TXD output on the microprocessor's CAN controller. An adequate external pull up resistor must be used to ensure that the TXD output of the microprocessor maintains adequate bit timing input to the CAN transceiver.