ZHCSJB4D April   2019  – January 2024 TAS2563

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  I2C Timing Requirements
    7. 5.7  SPI Timing Requirements
    8. 5.8  PDM Port Timing Requirements
    9. 5.9  TDM Port Timing Requirements
    10. 5.10 Timing Diagrams
    11. 5.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PurePath Console 3 Software
      2. 7.3.2  Device Mode and Address Selection
      3. 7.3.3  General I2C Operation
      4. 7.3.4  General SPI Operation
      5. 7.3.5  Single-Byte and Multiple-Byte Transfers
      6. 7.3.6  Single-Byte Write
      7. 7.3.7  Multiple-Byte Write and Incremental Multiple-Byte Write
      8. 7.3.8  Single-Byte Read
      9. 7.3.9  Multiple-Byte Read
      10. 7.3.10 Register Organization
      11. 7.3.11 Operational Modes
        1. 7.3.11.1 Hardware Shutdown
        2. 7.3.11.2 Software Shutdown
        3. 7.3.11.3 Mute
        4. 7.3.11.4 Active
        5. 7.3.11.5 Perform Load Diagnostics
        6. 7.3.11.6 Mode Control and Software Reset
      12. 7.3.12 Faults and Status
      13. 7.3.13 Digital Input Pull Downs
    4. 7.4 Device Functional Modes
      1. 7.4.1 PDM Input
      2. 7.4.2 TDM Port
      3. 7.4.3 Playback Signal Path
        1. 7.4.3.1 Digital Signal Processor
        2. 7.4.3.2 High Pass Filter
        3. 7.4.3.3 Digital Volume Control and Amplifier Output Level
        4. 7.4.3.4 Auto-mute During Idle Channel Mode
        5. 7.4.3.5 Auto-start/stop on Audio Clocks
        6. 7.4.3.6 Supply Tracking Limiters with Brown Out Prevention
        7. 7.4.3.7 Class-D Settings
      4. 7.4.4 SAR ADC
      5. 7.4.5 Boost
      6. 7.4.6 IV Sense
      7. 7.4.7 Load Diagnostics
      8. 7.4.8 Clocks and PLL
      9. 7.4.9 Thermal Foldback
    5. 7.5 Register Maps
      1. 7.5.1  Register Summary Table Page=0x00
      2. 7.5.2  PAGE (page=0x00 address=0x00) [reset=0h]
      3. 7.5.3  SW_RESET (page=0x00 address=0x01) [reset=0h]
      4. 7.5.4  PWR_CTL (page=0x00 address=0x02) [reset=Eh]
      5. 7.5.5  PB_CFG1 (page=0x00 address=0x03) [reset=20h]
      6. 7.5.6  MISC_CFG1 (page=0x00 address=0x04) [reset=C6h]
      7. 7.5.7  MISC_CFG2 (page=0x00 address=0x05) [reset=22h]
      8. 7.5.8  TDM_CFG0 (page=0x00 address=0x06) [reset=9h]
      9. 7.5.9  TDM_CFG1 (page=0x00 address=0x07) [reset=2h]
      10. 7.5.10 TDM_CFG2 (page=0x00 address=0x08) [reset=4Ah]
      11. 7.5.11 TDM_CFG3 (page=0x00 address=0x09) [reset=10h]
      12. 7.5.12 TDM_CFG4 (page=0x00 address=0x0A) [reset=13h]
      13. 7.5.13 TDM_CFG5 (page=0x00 address=0x0B) [reset=2h]
      14. 7.5.14 TDM_CFG6 (page=0x00 address=0x0C) [reset=0h]
      15. 7.5.15 TDM_CFG7 (page=0x00 address=0x0D) [reset=4h]
      16. 7.5.16 TDM_CFG8 (page=0x00 address=0x0E) [reset=5h]
      17. 7.5.17 TDM_CFG9 (page=0x00 address=0x0F) [reset=6h]
      18. 7.5.18 TDM_CFG10 (page=0x00 address=0x10) [reset=7h]
      19. 7.5.19 DSP Mode & TDM_DET (page=0x00 address=0x11) [reset=7Fh]
      20. 7.5.20 LIM_CFG0 (page=0x00 address=0x12) [reset=12h]
      21. 7.5.21 LIM_CFG1 (page=0x00 address=0x13) [reset=76h]
      22. 7.5.22 DSP FREQUENCY & BOP_CFG0 (page=0x00 address=0x14) [reset=1h]
      23. 7.5.23 BOP_CFG0 (page=0x00 address=0x15) [reset=2Eh]
      24. 7.5.24 BIL_and_ICLA_CFG0 (page=0x00 address=0x16) [reset=60h]
      25. 7.5.25 BIL_ICLA_CFG1 (page=0x00 address=0x17) [reset=0h]
      26. 7.5.26 GAIN_ICLA_CFG0 (page=0x00 address=0x18) [reset=0h]
      27. 7.5.27 ICLA_CFG1 (page=0x00 address=0x19) [reset=0h]
      28. 7.5.28 INT_MASK0 (page=0x00 address=0x1A) [reset=FCh]
      29. 7.5.29 INT_MASK1 (page=0x00 address=0x1B) [reset=A6h]
      30. 7.5.30 INT_MASK2 (page=0x00 address=0x1C) [reset=DFh]
      31. 7.5.31 INT_MASK3 (page=0x00 address=0x1D) [reset=FFh]
      32. 7.5.32 INT_LIVE0 (page=0x00 address=0x1F) [reset=0h]
      33. 7.5.33 INT_LIVE1 (page=0x00 address=0x20) [reset=0h]
      34. 7.5.34 INT_LIVE3 (page=0x00 address=0x21) [reset=0h]
      35. 7.5.35 INT_LIVE4 (page=0x00 address=0x22) [reset=0h]
      36. 7.5.36 INT_LTCH0 (page=0x00 address=0x24) [reset=0h]
      37. 7.5.37 INT_LTCH1 (page=0x00 address=0x25) [reset=0h]
      38. 7.5.38 INT_LTCH3 (page=0x00 address=0x26) [reset=0h]
      39. 7.5.39 INT_LTCH4 (page=0x00 address=0x27) [reset=0h]
      40. 7.5.40 VBAT_MSB (page=0x00 address=0x2A) [reset=0h]
      41. 7.5.41 VBAT_LSB (page=0x00 address=0x2B) [reset=0h]
      42. 7.5.42 TEMP (page=0x00 address=0x2C) [reset=0h]
      43. 7.5.43 INT & CLK CFG (page=0x00 address=0x30) [reset=19h]
      44. 7.5.44 DIN_PD (page=0x00 address=0x31) [reset=40h]
      45. 7.5.45 MISC (page=0x00 address=0x32) [reset=80h]
      46. 7.5.46 BOOST_CFG1 (page=0x00 address=0x33) [reset=34h]
      47. 7.5.47 BOOST_CFG2 (page=0x00 address=0x34) [reset=4Bh]
      48. 7.5.48 BOOST_CFG3 (page=0x00 address=0x35) [reset=74h]
      49. 7.5.49 MISC (page=0x00 address=0x3B) [reset=58h]
      50. 7.5.50 TG_CFG0 (page=0x00 address=0x3F) [reset=0h]
      51. 7.5.51 BST_ILIM_CFG0 (page=0x00 address=0x40) [reset=36h]
      52. 7.5.52 PDM_CONFIG0 (page=0x00 address=0x41) [reset=1h]
      53. 7.5.53 DIN_PD & PDM_CONFIG3 (page=0x00 address=0x42) [reset=F8h]
      54. 7.5.54 ASI2_CONFIG0 (page=0x00 address=0x43) [reset=8h]
      55. 7.5.55 ASI2_CONFIG1 (page=0x00 address=0x44) [reset=0h]
      56. 7.5.56 ASI2_CONFIG2 (page=0x00 address=0x45) [reset=1h]
      57. 7.5.57 ASI2_CONFIG3 (page=0x00 address=0x46) [reset=FCh]
      58. 7.5.58 PVDD_MSB_DSP (page=0x00 address=0x49) [reset=0h]
      59. 7.5.59 PVDD_LSB_DSP (page=0x00 address=0x4A) [reset=0h]
      60. 7.5.60 REV_ID (page=0x00 address=0x7D) [reset=0h]
      61. 7.5.61 I2C_CKSUM (page=0x00 address=0x7E) [reset=0h]
      62. 7.5.62 BOOK (page=0x00 address=0x7F) [reset=0h]
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Mono/Stereo Configuration
        2. 8.2.2.2 Boost Converter Passive Devices
        3. 8.2.2.3 EMI Passive Devices
        4. 8.2.2.4 Miscellaneous Passive Devices
      3. 8.2.3 Application Curves
  10. Power Supply Recommendations
    1. 9.1 Power Supplies
    2. 9.2 Power Supply Sequencing
      1. 9.2.1 Boost Supply Details
      2. 9.2.2 External Boost Mode (Boost Bypass Mode)
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YBG|42
  • RPP|32
散热焊盘机械数据 (封装 | 引脚)
订购信息

Faults and Status

During the power-up sequence, the power-on-reset circuit (POR) monitoring the VDD and VBAT pins will hold the device in reset (including all configuration registers) until the supply is valid. The device will not exit hardware shutdown until VDD and VBAT are valid and the SDZ pin is released. Once SDZ is released, the digital core voltage regulator will power up, enabling detection of the operational mode. If VDD dips below the POR threshold, the device will immediately be forced into a reset state.

The device also monitors the VBAT supply and holds the analog core in power down if the supply is below the UVLO threshold. If the TAS2563 is in active operation and a UVLO fault occurs, the analog supplies will immediately power down to protect the device. These faults are latching and require a transition through HW/SW shutdown to clear the fault. The live and latched registers will report UVLO faults.

The device transitions into software shutdown mode if it detects any faults with the TDM clocks such as:

• Invalid SBCLK to FSYNC ratio

• Invalid FSYNC frequency

• Halting of SBCLK or FSYNC clocks

Upon detection of a TDM clock error, the device transitions into software shutdown mode as quickly as possible to limit the possibility of audio artifacts. Once all TDM clock errors are resolved, the device volume ramps back to its previous playback state. During a TDM clock error, the IRQZ pin will assert low if the clock error interrupt mask register bit is set low (INT_MASK[2]). The clock fault is also available for readback in the live or latched fault status registers (INT_LIVE[2] and INT_LTCH[2]). Reading the latched fault status register (INT_LTCH[7:0]) clears the register.

The TAS2563 also monitors die temperature and Class-D load current and will enter software shutdown mode if either of these exceed safe values. As with the TDM clock error, the IRQZ pin will assert low for these faults if the appropriate fault interrupt mask register bit is set low (INT_MASK[0] for over temp and INT_MASK[1] for over current). The fault status can also be monitored in the live and latched fault registers as with the TDM clock error.

Die over temp and Class-D over current errors can either be latching (for example the device will enter software shutdown until a HW/SW shutdown sequence is applied) or they can be configured to automatically retry after a prescribed time. This behavior can be configured in the OTE_RETRY and OCE_RETRY register bits (for over temp and over current respectively). Even in latched mode, the Class-D will not attempt to retry after an over temp or over current error until the retry time period (1.5 s) has elapsed. This prevents applying repeated stress to the device in a rapid fashion that could lead to device damage. If the device has been cycled through SW/HW shutdown, the device will only begin to operate after the retry time period.

The status registers (and IRQZ pin if enabled via the status mask register) also indicates limiter behavior including when the limiter is activity, when VBAT is below the inflection point, when maximum attenuation has been applied, when the limiter is in infinite hold and when the limiter has muted the audio.

Interrupts can be queried using the INT_LIVE[9:0] and INT_LTCH[13:0] registers and correspond to the INT_MASK[10:0] Interrupts. The latched registers are cleared by writing the self clearing register INT_CLR_LTCH high.

The IRQZ pin is an open drain output that asserts low during unmasked fault conditions and therefore must be pulled up with a resistor to IOVDD. An internal pull up resistor is provided in the TAS2563 and can be accessed by setting the IRQZ_PU register bit high. Figure 7-10 below highlights the IRQZ pin circuit.

GUID-B1DF8E4C-7099-4781-AC1F-A5A11EA80B55-low.gifFigure 7-10 IRQZ Pin
Table 7-10 Fault Interrupt Mask
INT_MASK[10:0] BITINTERRUPTDEFAULT (1 = Mask)
0Over Temp Error
0
1Over Current Error
0
2TDM Clock Error
1
3Limiter Active
1
4Limter Voltage < Inf Point
1
5Limiter Max Atten
1
6Limiter Inf Hold
1
7Limiter Mute
1
8Brown Out on VBAT Supply
0
9Brown Out Protection Active
1
10Brown Out Power Down (Latched Only)
1
11:12Speaker Open Load (Latched Only)
00
13Load Diagnostic Complete (Latched Only)
1
Table 7-11 IRQ Clear Latched
INT_CLR_LTCHSTATE
0
Don't Clear
1
Clear (self clearing)
Table 7-12 IRQZ Internal Pull Up Enable
IRQZ_PUSTATE
0
Disabled (default)
1
Enabled
Table 7-13 IRQZ Polarity
IRQZ_POLSTATE
0
Active High
1
Active Low (default)
Table 7-14 IRQZ Assert Interrupt Configuration
IRQZ_PIN_CFG[1:0]VALUE
00
On any unmasked live interrupts
01
On any unmasked latched interrupts (default)
10
For 2-4 ms one time on any unmasked live interrupt event
11
For 2-4 ms every 4 ms on any unmasked latched interrupts
Table 7-15 Retry after Over Current Event
OCE_RETRYSTATE
0
Disabled (default)
1
Enabled
Table 7-16 Retry after Over Temperature Event
OTE_RETRYVALUE
0
Do not retry (default)
1
Retry after 1.5s