ZHCSR91E September   2006  – December 2022 SN74LVC1T45-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VCCA = 1.8 V ±0.15 V
    7. 6.7  Switching Characteristics: VCCA = 2.5 V ±0.2 V
    8. 6.8  Switching Characteristics: VCCA = 3.3 V ±0.3 V
    9. 6.9  Switching Characteristics: VCCA = 5 V ±0.5 V
    10. 6.10 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1.      Application and Implementation
        1. 8.1 Application Information
          1. 8.1.1 Enable Times
        2. 8.2 Typical Applications
          1. 8.2.1 Unidirectional Logic Level-Shifting Application
            1. 8.2.1.1 Design Requirements
            2. 8.2.1.2 Detailed Design Procedure
            3. 8.2.1.3 Application Curves
          2. 8.2.2 Bidirectional Logic Level-Shifting Application
            1. 8.2.2.1 Detailed Design Procedure
            2. 8.2.2.2 Application Curves
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCK|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)SN74LVC1T45-Q1UNIT
DCK (SC70)
6 PINS
RθJAJunction-to-ambient thermal resistance210.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance139.2°C/W
RθJBJunction-to-board thermal resistance72°C/W
ψJTJunction-to-top characterization parameter54.9°C/W
ψJBJunction-to-board characterization parameter71.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.